
AMD Xilinx
XC2018-50PG84B
XC2018-50PG84B ECAD Model
XC2018-50PG84B Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 74 | |
Number of Outputs | 74 | |
Number of Logic Cells | 100 | |
Number of Equivalent Gates | 1000 | |
Number of CLBs | 100 | |
Combinatorial Delay of a CLB-Max | 15 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | MIL-STD-883 Class B | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 100 CLBS, 1000 GATES | |
Additional Feature | 174 FLIP-FLOPS; TYP. GATES = 1000-1500 | |
Clock Frequency-Max | 50 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-CPGA-P84 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 84 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | PGA | |
Package Equivalence Code | PGA84M,11X11 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | NO | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 27.94 mm | |
Length | 27.94 mm | |
Seated Height-Max | 5.207 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | PGA, PGA84M,11X11 | |
Pin Count | 84 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.2.C |
XC2018-50PG84B Datasheet Download
XC2018-50PG84B Overview
The chip model XC2018-50PG84B is the latest development in the semiconductor industry, and it has the potential to revolutionize the way we use technology. With its advanced features, it has the potential to become the go-to choice for a variety of applications.
The XC2018-50PG84B is a single-chip solution that is designed to be used in a variety of applications. It is designed to be highly efficient, with low power consumption and low cost. It is also designed to be highly reliable, with a high level of reliability and quality. This makes it ideal for a variety of applications, including network applications, intelligent scenarios, and more.
The XC2018-50PG84B has several advantages over other chip models. It is designed to be highly efficient, with low power consumption and low cost. It is also designed to be highly reliable, with a high level of reliability and quality. This makes it ideal for a variety of applications, including network applications, intelligent scenarios, and more.
In terms of industry trends, the XC2018-50PG84B is expected to be in high demand in the coming years. As technology advances, more applications are being developed that require the use of this chip model. In addition, the chip model is expected to be used in a variety of networks and intelligent scenarios, as well as in the era of fully intelligent systems.
The XC2018-50PG84B is a powerful chip model that has the potential to revolutionize the way we use technology. With its advanced features, it has the potential to become the go-to choice for a variety of applications. It is designed to be highly efficient, with low power consumption and low cost. It is also designed to be highly reliable, with a high level of reliability and quality. This makes it ideal for a variety of applications, including network applications, intelligent scenarios, and more. As technology advances, the demand for this chip model is expected to increase, and it is likely to be used in a variety of networks and intelligent scenarios, as well as in the era of fully intelligent systems.
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