AMD Xilinx
XC2018-50PC84I
XC2018-50PC84I ECAD Model
XC2018-50PC84I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 74 | |
| Number of Outputs | 74 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 15 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1000 GATES | |
| Additional Feature | MAX. 74 I/OS; 174 FLIP-FLOPS; TYP. GATES = 1000 - 1500 | |
| Clock Frequency-Max | 50 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 4.699 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | QCCJ, LDCC84,1.2SQ | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC2018-50PC84I Datasheet Download
XC2018-50PC84I Overview
The chip model XC2018-50PC84I is a powerful, versatile processor that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a language used for designing and verifying digital systems. This chip model is designed to meet the needs of the increasingly complex and demanding digital world.
As the demand for faster, more efficient, and more reliable technology grows, the chip model XC2018-50PC84I is well-positioned to meet these needs. It has the potential to be used in a wide range of applications, from networking to image processing and embedded systems. In the future, this chip model could even be used in fully intelligent systems, as it has the capability to process vast amounts of data quickly and accurately.
In terms of industry trends, the chip model XC2018-50PC84I is likely to be used in a variety of scenarios, from connected devices to the Internet of Things. It is also likely to be used in networks, as it is capable of handling large amounts of data. In addition, it could be used in intelligent scenarios, such as self-driving cars and autonomous robots, as it has the power to process and interpret large amounts of data quickly.
The chip model XC2018-50PC84I is an impressive processor, capable of handling a wide range of tasks. It can be used in a variety of applications, from networking to image processing and embedded systems. In the future, it could even be used in fully intelligent systems, as it has the capability to process vast amounts of data quickly and accurately. With the increasing demand for faster, more efficient, and more reliable technology, the chip model XC2018-50PC84I is well-positioned to meet these needs.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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