XC2018-33PC68C
XC2018-33PC68C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC2018-33PC68C


XC2018-33PC68C
F20-XC2018-33PC68C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, QCCJ, LDCC68,1.0SQ
QCCJ, LDCC68,1.0SQ

XC2018-33PC68C ECAD Model


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XC2018-33PC68C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 58
Number of Outputs 58
Number of Logic Cells 100
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 33 MHz
Power Supplies 5 V
JESD-30 Code S-PQCC-J68
Qualification Status Not Qualified
Operating Temperature-Max 70 °C
Number of Terminals 68
Package Body Material PLASTIC/EPOXY
Package Code QCCJ
Package Equivalence Code LDCC68,1.0SQ
Package Shape SQUARE
Package Style CHIP CARRIER
Surface Mount YES
Terminal Form J BEND
Terminal Pitch 1.27 mm
Terminal Position QUAD
Ihs Manufacturer XILINX INC
Package Description QCCJ, LDCC68,1.0SQ
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC2018-33PC68C Datasheet Download


XC2018-33PC68C Overview



The XC2018-33PC68C chip model is a powerful and versatile solution for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL (Hardware Description Language) to provide enhanced performance and reliability.


The XC2018-33PC68C chip model is an excellent choice for applications that require high performance and reliability. It is suitable for a variety of applications, including networking, intelligent systems, and other applications that require high-speed processing. It is also well-suited for use in the era of fully intelligent systems, as it can be used to create a variety of intelligent scenarios.


The product description of the XC2018-33PC68C chip model includes a wide range of features and capabilities. It is designed to be highly reliable and can be used in a variety of applications. It is also designed to be compatible with a variety of HDL languages, allowing for increased flexibility and customization.


When designing with the XC2018-33PC68C chip model, it is important to consider the specific design requirements of the application. This includes selecting the appropriate HDL language, selecting the appropriate components, and considering the power requirements of the application. Additionally, it is important to consider the cost of the chip model and the potential for future upgrades.


To further understand the capabilities of the XC2018-33PC68C chip model, it is beneficial to review actual case studies of applications using the chip model. This can provide insights into the design process, as well as provide a better understanding of the performance of the chip model. Additionally, it is important to consider any potential risks associated with the chip model, such as power consumption, heat dissipation, and other potential risks.


In conclusion, the XC2018-33PC68C chip model is an excellent choice for applications that require high performance and reliability. It is suitable for a variety of applications, including networking, intelligent systems, and other applications that require high-speed processing. It is also well-suited for use in the era of fully intelligent systems, as it can be used to create a variety of intelligent scenarios. When designing with the XC2018-33PC68C chip model, it is important to consider the specific design requirements of the application, as well as any potential risks associated with the chip model. Additionally, it is beneficial to review actual case studies of applications using the chip model to gain a better understanding of the performance of the chip model.



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Unit Price: $17.584
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QTY Unit Price Ext Price
1+ $16.3531 $16.3531
10+ $16.1773 $161.7728
100+ $15.2981 $1,529.8080
1000+ $14.4189 $7,209.4400
10000+ $13.1880 $13,188.0000
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