AMD Xilinx
XC2018-100VQ64I
XC2018-100VQ64I ECAD Model
XC2018-100VQ64I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 54 | |
| Number of Outputs | 54 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 8 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1000 GATES | |
| Additional Feature | 174 FLIP-FLOPS; TYP. GATES = 1000-1500 | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G64 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 64 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | TQFP64,.47SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| Length | 10 mm | |
| Seated Height-Max | 1.27 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | PLASTIC, VQFP-64 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 64 |
XC2018-100VQ64I Datasheet Download
XC2018-100VQ64I Overview
The chip model XC2018-100VQ64I is a high-performance processor designed for digital signal processing, embedded processing, and image processing. It is equipped with a powerful 64-bit processor and requires the use of HDL language for programming. This chip model is widely used in a variety of applications, such as medical, industrial, and consumer electronics.
In the current market, the chip model XC2018-100VQ64I is a popular choice for its ability to process data quickly and accurately. As the demand for faster and more efficient data processing increases, the chip model XC2018-100VQ64I is becoming increasingly popular. This is due to its ability to process data faster and more accurately than other processors.
In terms of product description, the XC2018-100VQ64I chip model is designed to provide high-performance data processing capabilities. It is equipped with a 64-bit processor and requires the use of HDL language for programming. The chip model also features an on-chip memory controller and a high-speed bus interface. This allows the chip to access data quickly and accurately.
In terms of the application environment, the XC2018-100VQ64I chip model requires the support of new technologies to ensure optimal performance. This includes support for the latest technologies such as artificial intelligence (AI), machine learning, and deep learning. In addition, the chip model also requires support for the latest security protocols such as encryption and authentication.
When it comes to actual case studies and precautions, the XC2018-100VQ64I chip model is designed to be robust and reliable. It has been tested in a variety of applications and has been found to be reliable and efficient. However, it is important to note that the chip model should be used in accordance with the manufacturer's instructions and guidelines. In addition, the chip model should be regularly tested and monitored to ensure optimal performance.
In conclusion, the XC2018-100VQ64I chip model is a powerful and reliable processor designed for high-performance digital signal processing, embedded processing, and image processing. It is equipped with a powerful 64-bit processor and requires the use of HDL language for programming. The chip model also requires the support of new technologies such as AI, machine learning, and deep learning. Finally, it is important to use the chip model in accordance with the manufacturer's instructions and guidelines and to regularly test and monitor it to ensure optimal performance.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||