AMD Xilinx
XC2018-100TQ100C
XC2018-100TQ100C ECAD Model
XC2018-100TQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 74 | |
| Number of Outputs | 74 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 8 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1000 GATES | |
| Additional Feature | 174 FLIP-FLOPS; TYP. GATES = 1000-1500 | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2018-100TQ100C Datasheet Download
XC2018-100TQ100C Overview
Chip model XC2018-100TQ100C is a highly advanced integrated circuit (IC) manufactured by company X. It is designed for use in a variety of applications, ranging from consumer electronics to industrial and military systems. This model is designed to provide superior performance in terms of power consumption, cost, and reliability.
The XC2018-100TQ100C chip model has several advantages over other models. It is designed to be smaller, lighter, and more efficient than other models, meaning it can be used in a wide range of applications. It also has a high degree of integration, meaning it can be used to perform multiple functions in one chip. Additionally, the chip is designed with a low power consumption, making it ideal for use in battery-powered devices.
The expected demand for the XC2018-100TQ100C chip model in related industries is expected to remain strong in the future. This is due to the fact that the chip model is highly versatile and can be used in a variety of applications. Additionally, the chip model is designed with advanced features, such as high integration and low power consumption, which make it ideal for use in a variety of applications.
The original design intention of the XC2018-100TQ100C chip model was to provide a high-performance, cost-effective solution for a variety of applications. The chip model is designed to meet a variety of design requirements, such as providing high integration, low power consumption, and high reliability. Additionally, the chip model has the potential for future upgrades, allowing it to remain up-to-date with the latest technologies.
The product description and specific design requirements of the XC2018-100TQ100C chip model are detailed in the company's product specification documents. These documents provide detailed information on the chip model's design, performance, and features. Additionally, the product specification documents provide case studies and precautions that should be taken when using the chip model in specific applications.
Overall, the XC2018-100TQ100C chip model is a highly advanced and versatile integrated circuit designed for use in a variety of applications. It is designed to provide superior performance in terms of power consumption, cost, and reliability. Additionally, the chip model has the potential for future upgrades, making it ideal for use in advanced communication systems. The product specification documents provide detailed information on the chip model's design, performance, and features, as well as case studies and precautions that should be taken when using the chip model in specific applications.
You May Also Be Interested In
5,579 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8.0352 | $8.0352 |
| 10+ | $7.9488 | $79.4880 |
| 100+ | $7.5168 | $751.6800 |
| 1000+ | $7.0848 | $3,542.4000 |
| 10000+ | $6.4800 | $6,480.0000 |
| The price is for reference only, please refer to the actual quotation! | ||