AMD Xilinx
XC17S50XLPD8C
XC17S50XLPD8C ECAD Model
XC17S50XLPD8C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 559.232 kbit | |
| Memory Width | 1 | |
| Organization | 559232X1 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Power Supplies | 3.3 V | |
| Clock Frequency-Max (fCLK) | 10 MHz | |
| Memory IC Type | MEMORY CIRCUIT | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 559232 | |
| Number of Words | 559.232 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Standby Current-Max | 50 µA | |
| Supply Current-Max | 5 µA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 4.5974 mm | |
| Length | 9.3599 mm | |
| Width | 7.62 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP8,.3 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 |
XC17S50XLPD8C Datasheet Download
XC17S50XLPD8C Overview
The XC17S50XLPD8C chip model is a high-performance Field Programmable Gate Array (FPGA) designed for digital signal processing, embedded processing, and image processing. It is suitable for use in a variety of applications, including high-performance computing, industrial automation, and consumer electronics. The use of the XC17S50XLPD8C requires the support of HDL (Hardware Description Language) for programming and synthesis.
The XC17S50XLPD8C chip model is part of a larger trend in the industry towards more powerful and flexible FPGAs, which are becoming increasingly important for a variety of applications. As the demand for more complex and sophisticated systems grows, the need for powerful and flexible FPGAs such as the XC17S50XLPD8C will also increase. This chip model can be used in a variety of applications, including networking, image processing, and embedded systems.
The XC17S50XLPD8C chip model is also well-suited for use in the era of fully intelligent systems. With its powerful and flexible architecture, it can be used to develop complex systems that are capable of handling large amounts of data and performing sophisticated tasks. This chip model can also be used in a variety of intelligent scenarios, such as machine learning, natural language processing, and artificial intelligence.
In the future, the XC17S50XLPD8C chip model will be used in a variety of applications and scenarios, including networks, intelligent systems, and embedded systems. As the demand for more powerful and flexible FPGAs increases, the XC17S50XLPD8C will become even more important. This chip model will continue to be used in a variety of applications, as well as in the development of new technologies and applications.
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