XC17S200APD8G8C
XC17S200APD8G8C
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AMD Xilinx

XC17S200APD8G8C


XC17S200APD8G8C
F20-XC17S200APD8G8C
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DIP

XC17S200APD8G8C ECAD Model


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XC17S200APD8G8C Attributes


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XC17S200APD8G8C Overview



The XC17S200APD8G8C is a chip model from Xilinx Corporation, a leading provider of programmable logic devices. It is designed to provide high-performance, low-power, and cost-effective solutions for embedded systems. This chip model is suitable for a wide range of applications, including digital signal processing, high-speed networking, and wireless communication.


The original design intention of the XC17S200APD8G8C is to provide a robust, high-performance platform for a variety of applications. It is designed to be highly flexible, allowing users to customize the chip's functionality to meet their specific requirements. It is also designed to be energy-efficient, with a low power consumption that helps reduce operational costs.


The XC17S200APD8G8C is capable of supporting advanced communication systems, such as 5G and beyond. It is also capable of handling future upgrades and intelligent scenarios, such as machine learning, artificial intelligence, and data analytics. This chip model is well-suited for applications in the era of fully intelligent systems, such as autonomous vehicles, smart homes, and industrial automation.


The product description of the XC17S200APD8G8C includes a variety of features and specifications, such as a 200-pin TQFP package, 8MB of embedded flash memory, and a wide range of I/O interfaces. It also offers a variety of power management features, such as dynamic voltage scaling and power-saving modes.


In order to ensure the successful implementation of the XC17S200APD8G8C, it is important to consider the specific design requirements of the chip. This includes the selection of the appropriate package, the selection of the appropriate I/O interfaces, and the selection of the appropriate power management features. It is also important to consider the actual case studies of the chip, such as the environmental conditions it will be used in, the types of applications it will be used for, and the possible future upgrades that may be required. Finally, it is important to consider the precautions that should be taken when using the chip, such as proper handling and storage, as well as the proper use of the I/O interfaces.


In conclusion, the XC17S200APD8G8C is a powerful and efficient chip model that is suitable for a wide range of applications. It is capable of supporting advanced communication systems and intelligent scenarios, and is well-suited for applications in the era of fully intelligent systems. In order to ensure the successful implementation of the chip, it is important to consider the specific design requirements of the chip, as well as the actual case studies and precautions that should be taken when using it.



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