XC17S150APDG8C
XC17S150APDG8C
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rohs

AMD Xilinx

XC17S150APDG8C


XC17S150APDG8C
F20-XC17S150APDG8C
Active
CMOS, DIP
DIP

XC17S150APDG8C ECAD Model


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XC17S150APDG8C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Memory Density 1.0401 Mbit
Memory Width 1
Organization 1040096X1
Supply Voltage-Nom (Vsup) 3.3 V
Memory IC Type CONFIGURATION MEMORY
Number of Functions 1
Number of Words Code 1040096
Number of Words 1.0401 M
Operating Mode SYNCHRONOUS
Parallel/Serial SERIAL
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Technology CMOS
Temperature Grade COMMERCIAL
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Surface Mount NO
Terminal Finish Matte Tin (Sn)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Seated Height-Max 4.5974 mm
Length 9.3599 mm
Width 7.62 mm
Ihs Manufacturer XILINX INC
Part Package Code DIP
Package Description DIP,
Pin Count 8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51

XC17S150APDG8C Datasheet Download


XC17S150APDG8C Overview



The chip model XC17S150APDG8C is a product of Xilinx, a leading provider of programmable logic solutions. It is a family of high-performance, low-power, and low-cost FPGAs (Field Programmable Gate Arrays) that can be used for a wide range of applications. The XC17S150APDG8C is designed to provide high-speed data processing, high-bandwidth communications, and low-power operation. It is suitable for many applications, including embedded systems, digital signal processing, and automotive.


The XC17S150APDG8C is built on the latest Xilinx Virtex-7 FPGA technology and is designed to meet the demands of the most demanding applications. It features a large logic capacity, high-speed data processing, and low-power operation. It also has a wide range of peripherals, including memory, serial ports, and Ethernet. The XC17S150APDG8C is also designed to be flexible and easily upgradable, allowing users to quickly and easily upgrade their designs as new technologies become available.


In terms of industry trends, the XC17S150APDG8C can be used in a wide range of applications, including automotive, medical, and industrial. As technology advances, the XC17S150APDG8C can be used in more advanced applications, such as advanced communication systems and intelligent robots. For these applications, the XC17S150APDG8C can be used to provide the necessary hardware and software support. In addition, the XC17S150APDG8C can be used to develop and popularize future intelligent robots, as it provides the necessary computing power and flexibility.


In order to use the XC17S150APDG8C effectively, there are certain technical skills that are needed. These include knowledge of FPGA design, embedded programming, and digital signal processing. In addition, knowledge of the Xilinx Virtex-7 FPGA technology is also important. With the right technical skills, the XC17S150APDG8C can be used to develop and popularize future intelligent robots and other advanced applications.


In conclusion, the XC17S150APDG8C is a powerful and versatile chip model that can be used for a wide range of applications. It is designed to provide high-speed data processing, high-bandwidth communications, and low-power operation. It is also upgradable, allowing users to quickly and easily upgrade their designs as new technologies become available. With the right technical skills, the XC17S150APDG8C can be used to develop and popularize future intelligent robots and other advanced applications.



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