
AMD Xilinx
XC17S150APDG8C
XC17S150APDG8C ECAD Model
XC17S150APDG8C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Memory Density | 1.0401 Mbit | |
Memory Width | 1 | |
Organization | 1040096X1 | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Memory IC Type | CONFIGURATION MEMORY | |
Number of Functions | 1 | |
Number of Words Code | 1040096 | |
Number of Words | 1.0401 M | |
Operating Mode | SYNCHRONOUS | |
Parallel/Serial | SERIAL | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
JESD-30 Code | R-PDIP-T8 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Surface Mount | NO | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Seated Height-Max | 4.5974 mm | |
Length | 9.3599 mm | |
Width | 7.62 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 |
XC17S150APDG8C Datasheet Download
XC17S150APDG8C Overview
The chip model XC17S150APDG8C is a product of Xilinx, a leading provider of programmable logic solutions. It is a family of high-performance, low-power, and low-cost FPGAs (Field Programmable Gate Arrays) that can be used for a wide range of applications. The XC17S150APDG8C is designed to provide high-speed data processing, high-bandwidth communications, and low-power operation. It is suitable for many applications, including embedded systems, digital signal processing, and automotive.
The XC17S150APDG8C is built on the latest Xilinx Virtex-7 FPGA technology and is designed to meet the demands of the most demanding applications. It features a large logic capacity, high-speed data processing, and low-power operation. It also has a wide range of peripherals, including memory, serial ports, and Ethernet. The XC17S150APDG8C is also designed to be flexible and easily upgradable, allowing users to quickly and easily upgrade their designs as new technologies become available.
In terms of industry trends, the XC17S150APDG8C can be used in a wide range of applications, including automotive, medical, and industrial. As technology advances, the XC17S150APDG8C can be used in more advanced applications, such as advanced communication systems and intelligent robots. For these applications, the XC17S150APDG8C can be used to provide the necessary hardware and software support. In addition, the XC17S150APDG8C can be used to develop and popularize future intelligent robots, as it provides the necessary computing power and flexibility.
In order to use the XC17S150APDG8C effectively, there are certain technical skills that are needed. These include knowledge of FPGA design, embedded programming, and digital signal processing. In addition, knowledge of the Xilinx Virtex-7 FPGA technology is also important. With the right technical skills, the XC17S150APDG8C can be used to develop and popularize future intelligent robots and other advanced applications.
In conclusion, the XC17S150APDG8C is a powerful and versatile chip model that can be used for a wide range of applications. It is designed to provide high-speed data processing, high-bandwidth communications, and low-power operation. It is also upgradable, allowing users to quickly and easily upgrade their designs as new technologies become available. With the right technical skills, the XC17S150APDG8C can be used to develop and popularize future intelligent robots and other advanced applications.
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