XC1765LSO8C
XC1765LSO8C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC1765LSO8C


XC1765LSO8C
F20-XC1765LSO8C
Active
CMOS, PLASTIC, SOIC-8
PLASTIC, SOIC-8

XC1765LSO8C ECAD Model


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XC1765LSO8C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Memory Density 65.536 kbit
Memory Width 1
Organization 64KX1
Supply Voltage-Nom (Vsup) 5 V
Power Supplies 3.3 V
Clock Frequency-Max (fCLK) 2.5 MHz
Memory IC Type CONFIGURATION MEMORY
I/O Type COMMON
Number of Functions 1
Number of Words Code 64000
Number of Words 65.536 k
Operating Mode SYNCHRONOUS
Output Characteristics 3-STATE
Parallel/Serial SERIAL
Standby Current-Max 500 µA
Supply Current-Max 5 µA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Technology CMOS
Temperature Grade COMMERCIAL
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 8
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Seated Height-Max 1.75 mm
Length 4.9 mm
Width 3.9 mm
Ihs Manufacturer XILINX INC
Part Package Code SOIC
Package Description PLASTIC, SOIC-8
Pin Count 8
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.51

XC1765LSO8C Datasheet Download


XC1765LSO8C Overview



The XC1765LSO8C is a cutting-edge chip model that is suitable for a variety of high-performance applications, such as digital signal processing, embedded processing, and image processing. It is capable of supporting the use of HDL language, making it a versatile and powerful tool for many different tasks.


The XC1765LSO8C chip model is capable of being used in a wide range of applications, including networks and intelligent scenarios. Its powerful capabilities make it a great choice for the era of fully intelligent systems, allowing it to be used for a variety of tasks and applications.


The product description of the XC1765LSO8C chip model includes a range of features and specifications, including a wide range of memory sizes, a wide range of operating frequencies, and a variety of other features. It is designed to be a powerful and reliable chip model, capable of handling a wide range of tasks and applications.


Case studies and design requirements for the XC1765LSO8C chip model can be found in various resources, including online tutorials and technical documents. These resources provide detailed information about the design requirements and actual case studies of the chip model. It is important to take the time to understand the design requirements and actual case studies, as they can provide valuable insight into the capabilities and limitations of the chip model.


In addition, there are some precautions that should be taken when using the XC1765LSO8C chip model. It is important to ensure that the chip model is properly configured and that all necessary precautions are taken to avoid any problems. This includes ensuring that the chip model is properly cooled and that all necessary safety measures are taken.


The XC1765LSO8C chip model is a powerful and reliable chip model that can be used for a variety of applications. It is capable of being used in networks, intelligent scenarios, and the era of fully intelligent systems. With its wide range of features, specifications, and design requirements, the XC1765LSO8C chip model is a great choice for any task or application.



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Unit Price: $4.074
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3.7888 $3.7888
10+ $3.7481 $37.4808
100+ $3.5444 $354.4380
1000+ $3.3407 $1,670.3400
10000+ $3.0555 $3,055.5000
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