
AMD Xilinx
XC1765LPD8C
XC1765LPD8C ECAD Model
XC1765LPD8C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Memory Density | 65.536 kbit | |
Memory Width | 1 | |
Organization | 64KX1 | |
Supply Voltage-Nom (Vsup) | 5 V | |
Power Supplies | 3.3 V | |
Clock Frequency-Max (fCLK) | 2.5 MHz | |
Memory IC Type | CONFIGURATION MEMORY | |
I/O Type | COMMON | |
Number of Functions | 1 | |
Number of Words Code | 64000 | |
Number of Words | 65.536 k | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | 3-STATE | |
Parallel/Serial | SERIAL | |
Standby Current-Max | 1.5 mA | |
Supply Current-Max | 5 µA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
JESD-30 Code | R-PDIP-T8 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Surface Mount | NO | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Seated Height-Max | 4.5974 mm | |
Length | 9.3599 mm | |
Width | 7.62 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP8,.3 | |
Pin Count | 8 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 |
XC1765LPD8C Datasheet Download
XC1765LPD8C Overview
The XC1765LPD8C chip model is a cutting-edge semiconductor device designed to provide high-performance computing capabilities in a variety of applications. Developed by Xilinx, this chip model is part of the company's range of Field Programmable Gate Arrays (FPGAs). It is an 8-bit device that features a low-power design and a wide range of features.
The XC1765LPD8C chip model is designed to provide high-performance computing capabilities in a variety of applications. It features a low-power design, as well as a wide range of features that make it suitable for a variety of applications, including communication systems, automotive systems, industrial control, and medical devices. The device is capable of performing a wide range of operations, including data processing, image processing, and signal processing.
The XC1765LPD8C chip model has several advantages over other devices in its class. It is designed to be highly reliable, with a high level of integration and a low power consumption. Additionally, the device is capable of supporting a wide range of I/O standards, making it suitable for a variety of applications. It also features a wide range of features, such as high-speed signal processing, advanced memory management, and advanced debugging capabilities.
The XC1765LPD8C chip model has been designed with flexibility in mind, allowing for future upgrades and modifications. It is capable of supporting advanced communication systems, as well as other applications. The device is also designed to be upgradeable, allowing for the addition of new features or the modification of existing features.
The XC1765LPD8C chip model has been designed with specific design requirements in mind. These include a wide range of I/O standards, a high level of integration, and a low power consumption. Additionally, the device is designed to be highly reliable, with a wide range of features, such as high-speed signal processing, advanced memory management, and advanced debugging capabilities.
The XC1765LPD8C chip model has been designed to provide a wide range of features and capabilities. It is expected to be in high demand in the coming years as more and more applications require high-performance computing capabilities. Additionally, the device is designed to be upgradeable, allowing for the addition of new features or the modification of existing features.
In order to ensure the successful implementation of the XC1765LPD8C chip model, it is important to consider a number of factors. For example, it is important to consider the specific design requirements of the device, as well as the necessary precautions for its use. Additionally, it is important to consider actual case studies to ensure that the device meets the desired requirements.
Overall, the XC1765LPD8C chip model is a cutting-edge semiconductor device designed to provide high-performance computing capabilities in a variety of applications. It features a low-power design, as well as a wide range of features that make it suitable for a variety of applications, including communication systems, automotive systems, industrial control, and medical devices. The device is expected to be in high demand in the coming years, and is designed to be upgradeable, allowing for the addition of new features or the modification of existing features. In order to ensure the successful implementation of the XC1765LPD8C chip model, it is important to consider a number of factors, such as the specific design requirements of the device, as well as the necessary precautions for its use.
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