XC1765LPD8C
XC1765LPD8C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC1765LPD8C


XC1765LPD8C
F20-XC1765LPD8C
Active
CMOS, DIP, DIP8,.3
DIP, DIP8,.3

XC1765LPD8C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC1765LPD8C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Memory Density 65.536 kbit
Memory Width 1
Organization 64KX1
Supply Voltage-Nom (Vsup) 5 V
Power Supplies 3.3 V
Clock Frequency-Max (fCLK) 2.5 MHz
Memory IC Type CONFIGURATION MEMORY
I/O Type COMMON
Number of Functions 1
Number of Words Code 64000
Number of Words 65.536 k
Operating Mode SYNCHRONOUS
Output Characteristics 3-STATE
Parallel/Serial SERIAL
Standby Current-Max 1.5 mA
Supply Current-Max 5 µA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Technology CMOS
Temperature Grade COMMERCIAL
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Surface Mount NO
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Seated Height-Max 4.5974 mm
Length 9.3599 mm
Width 7.62 mm
Ihs Manufacturer XILINX INC
Part Package Code DIP
Package Description DIP, DIP8,.3
Pin Count 8
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.51

XC1765LPD8C Datasheet Download


XC1765LPD8C Overview



The XC1765LPD8C chip model is a cutting-edge semiconductor device designed to provide high-performance computing capabilities in a variety of applications. Developed by Xilinx, this chip model is part of the company's range of Field Programmable Gate Arrays (FPGAs). It is an 8-bit device that features a low-power design and a wide range of features.


The XC1765LPD8C chip model is designed to provide high-performance computing capabilities in a variety of applications. It features a low-power design, as well as a wide range of features that make it suitable for a variety of applications, including communication systems, automotive systems, industrial control, and medical devices. The device is capable of performing a wide range of operations, including data processing, image processing, and signal processing.


The XC1765LPD8C chip model has several advantages over other devices in its class. It is designed to be highly reliable, with a high level of integration and a low power consumption. Additionally, the device is capable of supporting a wide range of I/O standards, making it suitable for a variety of applications. It also features a wide range of features, such as high-speed signal processing, advanced memory management, and advanced debugging capabilities.


The XC1765LPD8C chip model has been designed with flexibility in mind, allowing for future upgrades and modifications. It is capable of supporting advanced communication systems, as well as other applications. The device is also designed to be upgradeable, allowing for the addition of new features or the modification of existing features.


The XC1765LPD8C chip model has been designed with specific design requirements in mind. These include a wide range of I/O standards, a high level of integration, and a low power consumption. Additionally, the device is designed to be highly reliable, with a wide range of features, such as high-speed signal processing, advanced memory management, and advanced debugging capabilities.


The XC1765LPD8C chip model has been designed to provide a wide range of features and capabilities. It is expected to be in high demand in the coming years as more and more applications require high-performance computing capabilities. Additionally, the device is designed to be upgradeable, allowing for the addition of new features or the modification of existing features.


In order to ensure the successful implementation of the XC1765LPD8C chip model, it is important to consider a number of factors. For example, it is important to consider the specific design requirements of the device, as well as the necessary precautions for its use. Additionally, it is important to consider actual case studies to ensure that the device meets the desired requirements.


Overall, the XC1765LPD8C chip model is a cutting-edge semiconductor device designed to provide high-performance computing capabilities in a variety of applications. It features a low-power design, as well as a wide range of features that make it suitable for a variety of applications, including communication systems, automotive systems, industrial control, and medical devices. The device is expected to be in high demand in the coming years, and is designed to be upgradeable, allowing for the addition of new features or the modification of existing features. In order to ensure the successful implementation of the XC1765LPD8C chip model, it is important to consider a number of factors, such as the specific design requirements of the device, as well as the necessary precautions for its use.



4,761 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote