AMD Xilinx
XC1765LPC20C
XC1765LPC20C ECAD Model
XC1765LPC20C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 65.536 kbit | |
| Memory Width | 1 | |
| Organization | 64KX1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 3.3 V | |
| Clock Frequency-Max (fCLK) | 2.5 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 64000 | |
| Number of Words | 65.536 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 1.5 mA | |
| Supply Current-Max | 5 µA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | S-PQCC-J20 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 20 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC20,.4SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Seated Height-Max | 4.572 mm | |
| Length | 8.9662 mm | |
| Width | 8.9662 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QLCC | |
| Package Description | PLASTIC, LCC-20 | |
| Pin Count | 20 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC1765LPC20C Datasheet Download
XC1765LPC20C Overview
The XC1765LPC20C chip model is a powerful tool for the modern world. It is one of the most advanced microcontrollers available today and is used in a variety of applications such as embedded systems, communication systems, and intelligent systems. This chip model has a wide range of features that make it suitable for a variety of industries.
The XC1765LPC20C chip model was designed with the intention of providing a powerful, yet cost-effective solution for a variety of applications. It has a powerful 32-bit processor core, a large on-chip memory, and a wide range of peripherals. It also supports a variety of communication protocols, making it suitable for a variety of applications.
In terms of industry trends, the XC1765LPC20C chip model is likely to remain popular due to its cost-effectiveness and wide range of features. As technology advances, the chip model may need to be upgraded to support new technologies. For example, it may need to support the latest communication protocols or the latest intelligent systems.
The XC1765LPC20C chip model is also likely to be used in intelligent systems, such as networks and intelligent scenarios. This chip model is capable of providing a powerful platform for building sophisticated systems and applications. It is also likely to be used in the era of fully intelligent systems, as it can provide the necessary processing power and features to support such systems.
In summary, the XC1765LPC20C chip model is a powerful and cost-effective tool for a variety of applications. It is likely to remain popular in the industry due to its features and cost-effectiveness. It is also likely to be used in intelligent systems and networks, as well as in the era of fully intelligent systems. Its original design intention and the possibility of future upgrades will determine its future applications.
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