AMD Xilinx
XC1765DSO8I
XC1765DSO8I ECAD Model
XC1765DSO8I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 65.536 kbit | |
| Memory Width | 1 | |
| Organization | 64KX1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 5 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 64000 | |
| Number of Words | 65.536 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 1.5 mA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PDSO-G8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 1.75 mm | |
| Length | 4.9 mm | |
| Width | 3.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | SOIC | |
| Package Description | PLASTIC, SOIC-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC1765DSO8I Datasheet Download
XC1765DSO8I Overview
The XC1765DSO8I chip model is a high-performance digital signal processor (DSP) developed by Xilinx, a leading provider of programmable logic devices. It is suitable for a wide range of applications, including embedded processing, image processing, and high-performance digital signal processing. The chip model is based on the Virtex-5 FPGA architecture and requires the use of HDL (Hardware Description Language) for programming.
The XC1765DSO8I chip model is highly advantageous for digital signal processing, as it offers a high degree of flexibility and scalability. It can be used to implement a wide range of algorithms, including digital filter design, fast Fourier transforms, and digital signal processing. It also supports the development of complex digital systems, such as digital video and audio systems.
In terms of industry trends, the XC1765DSO8I chip model is expected to be widely adopted in the future, as it is a reliable and cost-effective solution for a variety of applications. The chip model is designed to support the latest technologies, such as multi-core processors, high-speed memory interfaces, and high-speed I/O. It also provides a high degree of flexibility and scalability, which makes it suitable for a wide range of applications.
In terms of product description, the XC1765DSO8I chip model is a high-performance DSP that is based on the Virtex-5 FPGA architecture. It is designed to support a wide range of applications, including embedded processing, image processing, and high-performance digital signal processing. The chip model requires the use of HDL (Hardware Description Language) for programming.
In terms of design requirements, the XC1765DSO8I chip model requires the use of HDL (Hardware Description Language) for programming. It is designed to support a wide range of applications, including embedded processing, image processing, and high-performance digital signal processing. It also supports the development of complex digital systems, such as digital video and audio systems.
When using the XC1765DSO8I chip model, it is important to consider the potential risks associated with the use of the chip model. It is important to ensure that the chip model is used in a secure and reliable manner, as it is designed to support a wide range of applications. Additionally, it is important to ensure that the chip model is used in accordance with the manufacturer's instructions and design requirements.
Overall, the XC1765DSO8I chip model is a reliable and cost-effective solution for a variety of applications. It is designed to support the latest technologies, such as multi-core processors, high-speed memory interfaces, and high-speed I/O. Additionally, it provides a high degree of flexibility and scalability, which makes it suitable for a wide range of applications. However, it is important to ensure that the chip model is used in a secure and reliable manner, as it is designed to support a wide range of applications.
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1,438 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $32.0337 | $32.0337 |
| 10+ | $31.6892 | $316.8922 |
| 100+ | $29.9670 | $2,996.6976 |
| 1000+ | $28.2447 | $14,122.3680 |
| 10000+ | $25.8336 | $25,833.6000 |
| The price is for reference only, please refer to the actual quotation! | ||