AMD Xilinx
XC1765DPC20C
XC1765DPC20C ECAD Model
XC1765DPC20C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 65.536 kbit | |
| Memory Width | 1 | |
| Organization | 64KX1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 5 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 64000 | |
| Number of Words | 65.536 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 1.5 mA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | S-PQCC-J20 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 20 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC20,.4SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Seated Height-Max | 4.572 mm | |
| Length | 8.9662 mm | |
| Width | 8.9662 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QLCC | |
| Package Description | PLASTIC, LCC-20 | |
| Pin Count | 20 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC1765DPC20C Datasheet Download
XC1765DPC20C Overview
The XC1765DPC20C chip model is a powerful, yet cost-effective, solution for communication systems. It was designed with the intention of providing a reliable, high-performance solution for a wide range of applications. It is a highly integrated chip that offers a variety of features and benefits, including low power consumption, high speed, and high reliability.
The XC1765DPC20C is a versatile chip that can be used in a variety of communication systems. It is capable of supporting advanced communication protocols such as Ethernet, Wi-Fi, and Bluetooth, as well as advanced wireless communication technologies such as Zigbee, Z-wave, and RFID. It is also capable of supporting a variety of different networking topologies, including point-to-point, mesh, and star networks.
In addition, the XC1765DPC20C is capable of supporting a variety of intelligent scenarios. It can be used to provide intelligent control over a network of devices, or to provide a secure connection between devices. It can also be used to provide intelligent routing of data over a network, or to provide intelligent decision making in a connected system.
The XC1765DPC20C is designed to be highly reliable and cost-effective. It is also designed to be highly scalable, allowing for future upgrades and modifications. It is capable of supporting a range of different communication protocols and technologies, and can be used in a variety of different applications.
The product description of the XC1765DPC20C includes a detailed list of its features and benefits, as well as information on its design requirements. This includes information on the power consumption, speed, and reliability of the chip, as well as information on its compatibility with different communication protocols and technologies.
Case studies of the XC1765DPC20C can provide valuable insight into its performance in the real world. These case studies can provide information on the performance of the chip in different scenarios, and can also provide information on how it can be used in different applications.
When using the XC1765DPC20C, it is important to be aware of the potential risks associated with its use. It is important to ensure that the chip is properly installed and configured, and that it is used in accordance with the manufacturer’s instructions. It is also important to ensure that the chip is used in an environment that is free from interference and is not subject to any unexpected power outages.
The XC1765DPC20C is a powerful and cost-effective solution for communication systems. It is capable of supporting a variety of communication protocols and technologies, and can be used in a variety of applications. It is also highly scalable and can be upgraded in the future. With proper installation and configuration, the XC1765DPC20C can provide reliable, high-performance solutions for a wide range of applications.
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5,405 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1.7856 | $1.7856 |
| 10+ | $1.7664 | $17.6640 |
| 100+ | $1.6704 | $167.0400 |
| 1000+ | $1.5744 | $787.2000 |
| 10000+ | $1.4400 | $1,440.0000 |
| The price is for reference only, please refer to the actual quotation! | ||