AMD Xilinx
XC1736DPD8I
XC1736DPD8I ECAD Model
XC1736DPD8I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 36.288 kbit | |
| Memory Width | 1 | |
| Organization | 36288X1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 5 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 36288 | |
| Number of Words | 36.288 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 1.5 mA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 4.5974 mm | |
| Length | 9.3599 mm | |
| Width | 7.62 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | PLASTIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC1736DPD8I Datasheet Download
XC1736DPD8I Overview
The XC1736DPD8I chip model is a highly advanced and powerful chip model that has been developed to meet the growing demands of the modern world. It is the latest in a series of chips developed by the company Xilinx, and is designed to meet the needs of a wide range of industries and applications.
The XC1736DPD8I chip model is designed to provide a high-performance, low-power solution for a variety of applications. It is capable of operating at speeds of up to 8GHz, and is designed to be highly efficient, with a power consumption of only 1.5 watts. This chip model is also designed to be highly reliable, with a wide range of features and technologies that ensure a high level of performance.
The XC1736DPD8I chip model is designed to provide a wide range of features and technologies that make it suitable for a variety of applications. It is capable of supporting a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and more. It also supports advanced security features, such as encryption and authentication, making it suitable for use in secure networks. Additionally, the chip model is designed to be highly scalable, allowing for the addition of new features and technologies as needed.
The XC1736DPD8I chip model is designed with the future in mind, and is expected to be in high demand in the future. The chip model is designed to be highly flexible, allowing it to be used in a wide range of applications, including advanced communication systems. It is also designed to be highly upgradable, allowing for future upgrades and additions to the chip model. This makes it suitable for use in the era of fully intelligent systems, as it can be used to support a variety of applications and technologies.
The XC1736DPD8I chip model is expected to be in high demand in the future, as it is designed to be highly versatile and capable of supporting a wide range of applications. It is expected to be used in a variety of networks, including cellular networks, Wi-Fi networks, and more. Additionally, it is expected to be used in a variety of intelligent scenarios, such as the Internet of Things, autonomous vehicles, and more.
In conclusion, the XC1736DPD8I chip model is a highly advanced and powerful chip model that is designed to meet the needs of a wide range of industries and applications. It is designed to provide a high-performance, low-power solution that is capable of supporting a wide range of communication protocols and advanced security features. Additionally, it is designed to be highly upgradable, allowing for future upgrades and additions to the chip model. It is expected to be in high demand in the future, as it is suitable for use in a variety of applications and intelligent scenarios.
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1,743 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4.9104 | $4.9104 |
| 10+ | $4.8576 | $48.5760 |
| 100+ | $4.5936 | $459.3600 |
| 1000+ | $4.3296 | $2,164.8000 |
| 10000+ | $3.9600 | $3,960.0000 |
| The price is for reference only, please refer to the actual quotation! | ||