AMD Xilinx
XC1736DPC20I
XC1736DPC20I ECAD Model
XC1736DPC20I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 36.288 kbit | |
| Memory Width | 1 | |
| Organization | 36288X1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 5 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 36288 | |
| Number of Words | 36.288 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 1.5 mA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | S-PQCC-J20 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 20 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC20,.4SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Seated Height-Max | 4.572 mm | |
| Length | 8.9662 mm | |
| Width | 8.9662 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QLCC | |
| Package Description | PLASTIC, LCC-20 | |
| Pin Count | 20 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC1736DPC20I Datasheet Download
XC1736DPC20I Overview
The XC1736DPC20I is a state-of-the-art chip model that is suitable for a variety of high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL language, making it a powerful and versatile tool for developing complex systems.
The XC1736DPC20I is a powerful chip model that can be used in a variety of industries. It is capable of handling complex tasks such as digital signal processing, embedded processing, and image processing. It is also capable of providing reliable performance in a wide range of applications.
The XC1736DPC20I is designed to be used with the HDL language, making it a powerful tool for developing complex systems. It is also designed to be used with other technologies such as FPGAs, ASICs, and CPUs. This makes it a versatile tool for a variety of applications.
The XC1736DPC20I is a powerful chip model that can be used in a variety of industries. It is capable of handling complex tasks such as digital signal processing, embedded processing, and image processing. It is also capable of providing reliable performance in a wide range of applications.
The product description and design requirements of the XC1736DPC20I are detailed in the product documentation. Additionally, case studies and precautions are also available to provide guidance on how to use the chip model.
The industry trends of the XC1736DPC20I and the future development of related industries are determined, in part, by the technologies used in the application environment. As new technologies become available, the chip model may need to be updated to keep up with the trends.
In conclusion, the XC1736DPC20I is a powerful and versatile chip model that is capable of providing reliable performance in a wide range of applications. It is designed to be used with the HDL language, making it a powerful tool for developing complex systems. The product description and design requirements of the chip model are detailed in the product documentation, and case studies and precautions are also available to provide guidance on how to use the chip model. The industry trends of the XC1736DPC20I and the future development of related industries are determined, in part, by the technologies used in the application environment. As new technologies become available, the chip model may need to be updated to keep up with the trends.
You May Also Be Interested In
1,395 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6.2970 | $6.2970 |
| 10+ | $6.2293 | $62.2932 |
| 100+ | $5.8908 | $589.0770 |
| 1000+ | $5.5522 | $2,776.1100 |
| 10000+ | $5.0783 | $5,078.2500 |
| The price is for reference only, please refer to the actual quotation! | ||