AMD Xilinx
XC17256LPD8C
XC17256LPD8C ECAD Model
XC17256LPD8C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 262.144 kbit | |
| Memory Width | 1 | |
| Organization | 256KX1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 3.3 V | |
| Clock Frequency-Max (fCLK) | 10 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 256000 | |
| Number of Words | 262.144 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 50 µA | |
| Supply Current-Max | 5 µA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 4.5974 mm | |
| Length | 9.3599 mm | |
| Width | 7.62 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP8,.3 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC17256LPD8C Datasheet Download
XC17256LPD8C Overview
The XC17256LPD8C chip model is a high-performance, low-power field programmable gate array (FPGA) designed for digital signal processing, embedded processing, and image processing. It is capable of meeting the needs of a variety of applications, ranging from consumer electronics to industrial automation. The XC17256LPD8C is programmed using the hardware description language (HDL) and is capable of handling a wide range of tasks, including data acquisition, signal processing, image processing, and control.
The XC17256LPD8C chip model offers several advantages over other FPGA models, including a high level of integration, low power consumption, and a wide range of configurability. The chip model is also highly scalable, allowing for future expansion and development. As the demand for digital signal processing, embedded processing, and image processing continues to grow, the XC17256LPD8C chip model is expected to become increasingly popular in related industries.
The XC17256LPD8C chip model can be used in the development and popularization of future intelligent robots. The chip model is capable of providing the necessary processing power and flexibility for the development of more advanced robots. To use the XC17256LPD8C chip model effectively, technical talents such as engineers and software developers with experience in HDL programming and robotics are needed. With the right technical expertise, the XC17256LPD8C chip model can be used to create highly advanced robots that can perform complex tasks.
In conclusion, the XC17256LPD8C chip model is a powerful and versatile FPGA that can be used in a variety of applications. It is well suited for digital signal processing, embedded processing, and image processing, and can be used in the development and popularization of future intelligent robots. To use the XC17256LPD8C chip model effectively, technical talents such as engineers and software developers with experience in HDL programming and robotics are needed.
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5,131 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6.6960 | $6.6960 |
| 10+ | $6.6240 | $66.2400 |
| 100+ | $6.2640 | $626.4000 |
| 1000+ | $5.9040 | $2,952.0000 |
| 10000+ | $5.4000 | $5,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||