AMD Xilinx
XC17256DVO8I
XC17256DVO8I ECAD Model
XC17256DVO8I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 262.144 kbit | |
| Memory Width | 1 | |
| Organization | 256KX1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 12 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 256000 | |
| Number of Words | 262.144 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 50 µA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PDSO-G8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP2 | |
| Package Equivalence Code | TSOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 1.1938 mm | |
| Length | 4.9276 mm | |
| Width | 3.937 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | TSOP | |
| Package Description | PLASTIC, TSOP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC17256DVO8I Datasheet Download
XC17256DVO8I Overview
The XC17256DVO8I model chip is a powerful tool for high performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language used to describe the behavior of digital logic circuits. This chip model can be used to create logic circuits that are optimized for a variety of applications, from high-speed data processing to image processing.
The original design intention of the XC17256DVO8I model chip was to provide a powerful and efficient platform for digital signal processing and embedded processing. This chip model is capable of being upgraded to meet the needs of more complex applications and can be used in advanced communication systems. It is also capable of being used in the development and popularization of future intelligent robots.
In order to use the XC17256DVO8I model chip effectively, it is important to have a thorough understanding of the HDL language. It is also important to have a good understanding of the chip's architecture and its capabilities. Having a good understanding of the chip's capabilities and limitations will help in the development of efficient and reliable logic circuits. Additionally, having a good understanding of the HDL language will help in the optimization of the logic circuits.
Overall, the XC17256DVO8I model chip is a powerful tool for high performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and is capable of being upgraded to meet the needs of more complex applications. It can also be used in the development and popularization of future intelligent robots. In order to use the XC17256DVO8I model chip effectively, it is important to have a thorough understanding of the HDL language and the chip's architecture and capabilities.
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5,687 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6.6960 | $6.6960 |
| 10+ | $6.6240 | $66.2400 |
| 100+ | $6.2640 | $626.4000 |
| 1000+ | $5.9040 | $2,952.0000 |
| 10000+ | $5.4000 | $5,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||