AMD Xilinx
XC17256DVO8C
XC17256DVO8C ECAD Model
XC17256DVO8C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 262.144 kbit | |
| Memory Width | 1 | |
| Organization | 256KX1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 12 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 256000 | |
| Number of Words | 262.144 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 50 µA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-PDSO-G8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP2 | |
| Package Equivalence Code | TSOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 1.1938 mm | |
| Length | 4.9276 mm | |
| Width | 3.937 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | TSOP | |
| Package Description | PLASTIC, TSOP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC17256DVO8C Datasheet Download
XC17256DVO8C Overview
The XC17256DVO8C chip model is a high-performance device designed for digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming, and it is a reliable and powerful device for such applications.
The XC17256DVO8C chip model is equipped with a wide range of features that make it an attractive choice for many industries. It has a high clock speed of up to 250 MHz and a large internal memory of up to 8MB. It also supports a variety of digital signal processing functions such as FFTs, FIR filters, and IIR filters. Moreover, it has a low power consumption of only 1.8 V and a low operating temperature of up to 85°C.
The XC17256DVO8C chip model has been designed to meet the demands of the ever-changing digital world and its applications. It is expected that the demand for this model will continue to grow in the future, as it provides a reliable and powerful solution for digital signal processing and embedded processing.
The original design intention of the XC17256DVO8C chip model was to provide a high-performance solution for digital signal processing, embedded processing, and image processing. It is also capable of supporting advanced communication systems, and it can be upgraded with additional features to meet the demands of future applications.
Overall, the XC17256DVO8C chip model is a reliable and powerful device for digital signal processing, embedded processing, and image processing applications. It has a wide range of features and is expected to be in high demand in the future. It is also capable of supporting advanced communication systems and can be upgraded with additional features to meet the demands of future applications.
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2,561 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6.6960 | $6.6960 |
| 10+ | $6.6240 | $66.2400 |
| 100+ | $6.2640 | $626.4000 |
| 1000+ | $5.9040 | $2,952.0000 |
| 10000+ | $5.4000 | $5,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||