AMD Xilinx
XC17256DPD8I
XC17256DPD8I ECAD Model
XC17256DPD8I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 262.144 kbit | |
| Memory Width | 1 | |
| Organization | 256KX1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 12 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 256000 | |
| Number of Words | 262.144 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 50 µA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 4.5974 mm | |
| Length | 9.3599 mm | |
| Width | 7.62 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | PLASTIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC17256DPD8I Datasheet Download
XC17256DPD8I Overview
The XC17256DPD8I is a chip model designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is specifically designed to be used with the HDL language, allowing users to design and program their own custom applications. This chip model offers a number of advantages, such as increased speed and accuracy, as well as a wide range of features that can be used for a variety of applications.
The XC17256DPD8I is expected to be in high demand in the near future, as more and more businesses and industries are looking for ways to increase their efficiency and performance. This model is perfect for applications that require high-speed processing, as well as those that need to handle complex data and image processing tasks. Additionally, this chip model is also suitable for use in advanced communication systems, as it provides a number of features that can help improve the speed and accuracy of these systems.
The original design intention of the XC17256DPD8I was to provide users with a chip model that could handle a wide range of tasks with increased speed and accuracy. This model is also capable of being upgraded in the future, allowing users to take advantage of new features and capabilities as technology advances. This chip model is perfect for those who need to handle complex tasks quickly and accurately, as well as those who need to stay up to date with the latest advancements in communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||