XC17256DDD8B
XC17256DDD8B
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC17256DDD8B


XC17256DDD8B
F20-XC17256DDD8B
Active
CMOS, DIP, DIP8,.3
DIP, DIP8,.3

XC17256DDD8B ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC17256DDD8B Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Memory Density 262.144 kbit
Memory Width 1
Organization 256KX1
Supply Voltage-Nom (Vsup) 5 V
Power Supplies 5 V
Clock Frequency-Max (fCLK) 12 MHz
Memory IC Type CONFIGURATION MEMORY
I/O Type COMMON
Number of Functions 1
Number of Words Code 256000
Number of Words 262.144 k
Operating Mode SYNCHRONOUS
Output Characteristics 3-STATE
Parallel/Serial SERIAL
Standby Current-Max 50 µA
Supply Current-Max 10 µA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Technology CMOS
Temperature Grade MILITARY
JESD-30 Code R-GDIP-T8
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Screening Level MIL-STD-883 Class B
Number of Terminals 8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Surface Mount NO
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Seated Height-Max 5.08 mm
Length 10.16 mm
Width 7.62 mm
Ihs Manufacturer XILINX INC
Part Package Code DIP
Package Description DIP, DIP8,.3
Pin Count 8
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51

XC17256DDD8B Datasheet Download


XC17256DDD8B Overview



The chip model XC17256DDD8B is a product of the Xilinx Corporation, a leader in the field of programmable logic devices. The chip model XC17256DDD8B is a high-performance, low-power FPGA (Field Programmable Gate Array) that can be used in a variety of applications. It is designed for use in the most demanding applications, such as high-speed networks, intelligent systems, and industrial automation.


The XC17256DDD8B has a powerful architecture that makes it suitable for a wide range of tasks. It is designed to be highly configurable, allowing users to customize their designs to meet their specific requirements. The chip model also features advanced security features, making it ideal for applications that require secure communication.


In terms of industry trends, the XC17256DDD8B is being used in a wide range of applications, such as industrial automation, medical devices, and smart home systems. As the demand for more sophisticated and intelligent systems increases, the chip model is likely to be used in more applications.


The XC17256DDD8B is also well-suited for use in the era of fully-intelligent systems. Its advanced features make it suitable for use in networks and intelligent scenarios, such as autonomous vehicles and smart cities. Furthermore, the chip model can be used with new technologies, such as artificial intelligence and machine learning, making it an ideal choice for applications that require advanced functionality.


In terms of product description and design requirements, the XC17256DDD8B is a powerful and highly configurable chip model. It is designed for use in the most demanding applications, and its advanced features make it suitable for use in networks and intelligent scenarios. Furthermore, it is designed with advanced security features, making it an ideal choice for applications that require secure communication.


When using the XC17256DDD8B, there are several important considerations to keep in mind. First, the chip model should be used in accordance with the manufacturer’s specifications. Second, the chip model should be tested thoroughly before being deployed in a production environment. Third, the chip model should be used with the latest software and firmware updates. Finally, the chip model should be used in conjunction with other components, such as sensors and actuators, to ensure the best performance.


In conclusion, the XC17256DDD8B is a powerful and highly configurable chip model that can be used in a variety of applications. It is well-suited for use in networks and intelligent scenarios, and it is designed with advanced security features. Furthermore, it can be used with new technologies, such as artificial intelligence and machine learning, making it an ideal choice for applications that require advanced functionality. When using the XC17256DDD8B, it is important to keep in mind the manufacturer’s specifications, as well as to thoroughly test the chip model before deploying it in a production environment.



1,612 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote