
AMD Xilinx
XC17256DDD8B
XC17256DDD8B ECAD Model
XC17256DDD8B Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Memory Density | 262.144 kbit | |
Memory Width | 1 | |
Organization | 256KX1 | |
Supply Voltage-Nom (Vsup) | 5 V | |
Power Supplies | 5 V | |
Clock Frequency-Max (fCLK) | 12 MHz | |
Memory IC Type | CONFIGURATION MEMORY | |
I/O Type | COMMON | |
Number of Functions | 1 | |
Number of Words Code | 256000 | |
Number of Words | 262.144 k | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | 3-STATE | |
Parallel/Serial | SERIAL | |
Standby Current-Max | 50 µA | |
Supply Current-Max | 10 µA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
JESD-30 Code | R-GDIP-T8 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Screening Level | MIL-STD-883 Class B | |
Number of Terminals | 8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Surface Mount | NO | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Seated Height-Max | 5.08 mm | |
Length | 10.16 mm | |
Width | 7.62 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP8,.3 | |
Pin Count | 8 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.51 |
XC17256DDD8B Datasheet Download
XC17256DDD8B Overview
The chip model XC17256DDD8B is a product of the Xilinx Corporation, a leader in the field of programmable logic devices. The chip model XC17256DDD8B is a high-performance, low-power FPGA (Field Programmable Gate Array) that can be used in a variety of applications. It is designed for use in the most demanding applications, such as high-speed networks, intelligent systems, and industrial automation.
The XC17256DDD8B has a powerful architecture that makes it suitable for a wide range of tasks. It is designed to be highly configurable, allowing users to customize their designs to meet their specific requirements. The chip model also features advanced security features, making it ideal for applications that require secure communication.
In terms of industry trends, the XC17256DDD8B is being used in a wide range of applications, such as industrial automation, medical devices, and smart home systems. As the demand for more sophisticated and intelligent systems increases, the chip model is likely to be used in more applications.
The XC17256DDD8B is also well-suited for use in the era of fully-intelligent systems. Its advanced features make it suitable for use in networks and intelligent scenarios, such as autonomous vehicles and smart cities. Furthermore, the chip model can be used with new technologies, such as artificial intelligence and machine learning, making it an ideal choice for applications that require advanced functionality.
In terms of product description and design requirements, the XC17256DDD8B is a powerful and highly configurable chip model. It is designed for use in the most demanding applications, and its advanced features make it suitable for use in networks and intelligent scenarios. Furthermore, it is designed with advanced security features, making it an ideal choice for applications that require secure communication.
When using the XC17256DDD8B, there are several important considerations to keep in mind. First, the chip model should be used in accordance with the manufacturer’s specifications. Second, the chip model should be tested thoroughly before being deployed in a production environment. Third, the chip model should be used with the latest software and firmware updates. Finally, the chip model should be used in conjunction with other components, such as sensors and actuators, to ensure the best performance.
In conclusion, the XC17256DDD8B is a powerful and highly configurable chip model that can be used in a variety of applications. It is well-suited for use in networks and intelligent scenarios, and it is designed with advanced security features. Furthermore, it can be used with new technologies, such as artificial intelligence and machine learning, making it an ideal choice for applications that require advanced functionality. When using the XC17256DDD8B, it is important to keep in mind the manufacturer’s specifications, as well as to thoroughly test the chip model before deploying it in a production environment.
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