AMD Xilinx
XC1718LSO8C
XC1718LSO8C ECAD Model
XC1718LSO8C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 18.144 kbit | |
| Memory Width | 1 | |
| Organization | 18144X1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 3.3 V | |
| Clock Frequency-Max (fCLK) | 2.5 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 18144 | |
| Number of Words | 18.144 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 500 µA | |
| Supply Current-Max | 5 µA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-PDSO-G8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 1.75 mm | |
| Length | 4.9 mm | |
| Width | 3.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | SOIC | |
| Package Description | PLASTIC, SOIC-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC1718LSO8C Datasheet Download
XC1718LSO8C Overview
The XC1718LSO8C chip model is a powerful processor designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be programmed in HDL language, which allows for greater control of the system's operations and the ability to customize the processor for a variety of tasks. The original design intention of the XC1718LSO8C chip model was to provide a powerful, yet cost-effective processor for a wide range of applications. It is also designed to be upgradeable, allowing for future improvements and upgrades to the chip to accommodate new technologies and applications.
The XC1718LSO8C chip model is well-suited for use in advanced communication systems, as it can be used to facilitate high-speed data transmission and processing. It can also be used in networks to enable intelligent decision making and control, while also providing a secure platform for data storage and transmission. In addition, the XC1718LSO8C chip model can be used in intelligent scenarios, such as robotics, artificial intelligence, and even autonomous vehicles. It can also be used in the era of fully intelligent systems, providing the necessary processing power and control to enable a wide range of applications.
In conclusion, the XC1718LSO8C chip model is a powerful and cost-effective processor that is designed to be upgradeable and suitable for a wide range of applications. It is especially well-suited for use in advanced communication systems, networks, and intelligent scenarios, and can be used in the era of fully intelligent systems. With its powerful processing capabilities and the ability to be programmed in HDL language, the XC1718LSO8C chip model is an ideal choice for a variety of applications.
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