XC1718LPD8C
XC1718LPD8C
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rohs

AMD Xilinx

XC1718LPD8C


XC1718LPD8C
F20-XC1718LPD8C
Active
CMOS, PLASTIC, DIP-8
PLASTIC, DIP-8

XC1718LPD8C ECAD Model


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XC1718LPD8C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Memory Density 18.144 kbit
Memory Width 1
Organization 18144X1
Supply Voltage-Nom (Vsup) 5 V
Power Supplies 3.3 V
Clock Frequency-Max (fCLK) 2.5 MHz
Memory IC Type CONFIGURATION MEMORY
I/O Type COMMON
Number of Functions 1
Number of Words Code 18144
Number of Words 18.144 k
Operating Mode SYNCHRONOUS
Output Characteristics 3-STATE
Parallel/Serial SERIAL
Standby Current-Max 1.5 mA
Supply Current-Max 5 µA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Technology CMOS
Temperature Grade COMMERCIAL
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Surface Mount NO
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Seated Height-Max 4.5974 mm
Length 9.3599 mm
Width 7.62 mm
Ihs Manufacturer XILINX INC
Part Package Code DIP
Package Description PLASTIC, DIP-8
Pin Count 8
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.51

XC1718LPD8C Datasheet Download


XC1718LPD8C Overview



The chip model XC1718LPD8C is a high-performance, low-power device designed for digital signal processing, embedded processing, image processing, and other related applications. It is programmed using HDL (Hardware Description Language) and can be used in a variety of systems. The original design intention of XC1718LPD8C was to provide a high-performance, low-power device that can handle a wide range of tasks efficiently and cost-effectively.


XC1718LPD8C is capable of being upgraded and improved over time, making it an ideal choice for advanced communication systems. Its high-performance and low-power design makes it suitable for a wide range of applications, including network systems, image processing, and other intelligent scenarios. Its flexibility and scalability allow it to be used in a variety of systems, from basic to advanced.


The chip model XC1718LPD8C is well-suited for the era of fully intelligent systems. Its advanced features enable it to handle complex tasks and provide reliable performance. It can be used in a variety of network systems, from basic to advanced, and its low-power design makes it suitable for applications that require long-term operation. Its scalability allows it to be used in a variety of intelligent scenarios, from basic to advanced.


In conclusion, the chip model XC1718LPD8C is an ideal choice for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is programmed using HDL and can be used in a variety of systems. It is also capable of being upgraded and improved over time, making it an ideal choice for advanced communication systems. Its flexibility and scalability allow it to be used in a variety of networks and intelligent scenarios, from basic to advanced, and its low-power design makes it suitable for applications that require long-term operation. It is well-suited for the era of fully intelligent systems and can handle complex tasks with reliable performance.



2,175 In Stock


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Unit Price: $2.2042
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QTY Unit Price Ext Price
1+ $2.0499 $2.0499
10+ $2.0279 $20.2786
100+ $1.9177 $191.7654
1000+ $1.8074 $903.7220
10000+ $1.6532 $1,653.1500
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