
AMD Xilinx
XC1718LPD8C
XC1718LPD8C ECAD Model
XC1718LPD8C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Memory Density | 18.144 kbit | |
Memory Width | 1 | |
Organization | 18144X1 | |
Supply Voltage-Nom (Vsup) | 5 V | |
Power Supplies | 3.3 V | |
Clock Frequency-Max (fCLK) | 2.5 MHz | |
Memory IC Type | CONFIGURATION MEMORY | |
I/O Type | COMMON | |
Number of Functions | 1 | |
Number of Words Code | 18144 | |
Number of Words | 18.144 k | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | 3-STATE | |
Parallel/Serial | SERIAL | |
Standby Current-Max | 1.5 mA | |
Supply Current-Max | 5 µA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
JESD-30 Code | R-PDIP-T8 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Surface Mount | NO | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Seated Height-Max | 4.5974 mm | |
Length | 9.3599 mm | |
Width | 7.62 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | DIP | |
Package Description | PLASTIC, DIP-8 | |
Pin Count | 8 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 |
XC1718LPD8C Datasheet Download
XC1718LPD8C Overview
The chip model XC1718LPD8C is a high-performance, low-power device designed for digital signal processing, embedded processing, image processing, and other related applications. It is programmed using HDL (Hardware Description Language) and can be used in a variety of systems. The original design intention of XC1718LPD8C was to provide a high-performance, low-power device that can handle a wide range of tasks efficiently and cost-effectively.
XC1718LPD8C is capable of being upgraded and improved over time, making it an ideal choice for advanced communication systems. Its high-performance and low-power design makes it suitable for a wide range of applications, including network systems, image processing, and other intelligent scenarios. Its flexibility and scalability allow it to be used in a variety of systems, from basic to advanced.
The chip model XC1718LPD8C is well-suited for the era of fully intelligent systems. Its advanced features enable it to handle complex tasks and provide reliable performance. It can be used in a variety of network systems, from basic to advanced, and its low-power design makes it suitable for applications that require long-term operation. Its scalability allows it to be used in a variety of intelligent scenarios, from basic to advanced.
In conclusion, the chip model XC1718LPD8C is an ideal choice for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is programmed using HDL and can be used in a variety of systems. It is also capable of being upgraded and improved over time, making it an ideal choice for advanced communication systems. Its flexibility and scalability allow it to be used in a variety of networks and intelligent scenarios, from basic to advanced, and its low-power design makes it suitable for applications that require long-term operation. It is well-suited for the era of fully intelligent systems and can handle complex tasks with reliable performance.
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2,175 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2.0499 | $2.0499 |
10+ | $2.0279 | $20.2786 |
100+ | $1.9177 | $191.7654 |
1000+ | $1.8074 | $903.7220 |
10000+ | $1.6532 | $1,653.1500 |
The price is for reference only, please refer to the actual quotation! |