AMD Xilinx
XC1718DSO8C
XC1718DSO8C ECAD Model
XC1718DSO8C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 18.144 kbit | |
| Memory Width | 1 | |
| Organization | 18144X1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 5 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 18144 | |
| Number of Words | 18.144 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 1.5 mA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-PDSO-G8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 1.75 mm | |
| Length | 4.9 mm | |
| Width | 3.9 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | SOIC | |
| Package Description | PLASTIC, SOIC-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC1718DSO8C Datasheet Download
XC1718DSO8C Overview
The chip model XC1718DSO8C is a powerful and versatile integrated circuit (IC) designed for high-performance digital signal processing and embedded processing applications. It is well suited for use in image processing and other data-intensive tasks. As such, it is an ideal choice for a wide range of applications in the digital age, from consumer electronics to industrial automation.
The XC1718DSO8C is programmed with the HDL (Hardware Description Language) language. This allows for the development of complex algorithms and systems that can be implemented quickly and easily. Furthermore, the chip is capable of handling large amounts of data, making it suitable for use in a variety of network applications.
The XC1718DSO8C is also a great choice for intelligent applications such as machine learning and artificial intelligence. Its capabilities make it suitable for use in the era of fully intelligent systems. Furthermore, its powerful processing power and fast data transfer rates mean that it can handle large amounts of data quickly and accurately.
When designing with the XC1718DSO8C, it is important to consider the specific design requirements of the chip. This includes the size of the memory, the number of pins, the clock speed, the I/O interface, and the power consumption. It is also important to make sure that the chip is compatible with the target system.
In order to ensure that the XC1718DSO8C is used correctly, it is important to read the datasheet and reference manual carefully before starting the design process. Furthermore, it is also important to consult with experienced engineers and designers who have worked with the chip before. This will help to ensure that the design process is successful and that the chip is used to its full potential.
In conclusion, the XC1718DSO8C is a powerful and versatile IC that is suitable for a wide range of applications in the digital age. It is programmed with the HDL language and is capable of handling large amounts of data quickly and accurately. Furthermore, it is a great choice for intelligent applications such as machine learning and artificial intelligence. When designing with the XC1718DSO8C, it is important to consider the specific design requirements of the chip and to consult with experienced engineers and designers who have worked with the chip before.
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|---|---|---|
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