AMD Xilinx
XC1718DPD8I
XC1718DPD8I ECAD Model
XC1718DPD8I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 18.144 kbit | |
| Memory Width | 1 | |
| Organization | 18144X1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 5 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 18144 | |
| Number of Words | 18.144 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 1.5 mA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 4.5974 mm | |
| Length | 9.3599 mm | |
| Width | 7.62 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | PLASTIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC1718DPD8I Datasheet Download
XC1718DPD8I Overview
The XC1718DPD8I chip model is one of the most advanced and efficient models on the market today. Developed by leading chip manufacturer XC Technologies, the XC1718DPD8I model is the latest addition to the company’s portfolio of high-performance chips.
The XC1718DPD8I chip model is designed to provide powerful performance and low power consumption. It features a dual-core processor that is capable of running at speeds of up to 3.2 GHz, as well as an integrated memory controller and a large on-chip cache. The chip model also integrates an advanced communication interface, allowing for high speed data transfer between devices. This makes the XC1718DPD8I an ideal choice for a wide range of applications, from high-end gaming to industrial automation.
The XC1718DPD8I chip model is expected to experience strong demand in the near future, as the demand for high-performance chips continues to grow. The chip model’s low power consumption, high performance, and integrated communication interface make it an ideal choice for a variety of applications, from embedded systems to industrial automation.
The XC1718DPD8I chip model was designed with the intention of providing powerful performance and low power consumption. The chip model can be easily upgraded to meet the needs of future applications, allowing for faster speeds and higher performance. The chip model is also capable of being used in advanced communication systems, making it an ideal choice for those looking to develop and deploy cutting-edge communication technologies.
The XC1718DPD8I chip model can also be applied to the development and popularization of future intelligent robots. The chip model’s powerful performance and low power consumption make it an ideal choice for powering robots that require advanced computing capabilities. In order to use the model effectively, technical talents such as software engineers and robotics experts will be needed to develop and deploy the necessary software and hardware.
In conclusion, the XC1718DPD8I chip model is an ideal choice for those looking for a powerful and efficient chip model. The chip model’s low power consumption, high performance, and integrated communication interface make it an ideal choice for a wide range of applications. The chip model is expected to experience strong demand in the near future, as the demand for high-performance chips continues to grow. The chip model can also be applied to the development and popularization of future intelligent robots, although technical talents will be needed to use the model effectively.
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4,159 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1.4508 | $1.4508 |
| 10+ | $1.4352 | $14.3520 |
| 100+ | $1.3572 | $135.7200 |
| 1000+ | $1.2792 | $639.6000 |
| 10000+ | $1.1700 | $1,170.0000 |
| The price is for reference only, please refer to the actual quotation! | ||