AMD Xilinx
XC1718DPD8C
XC1718DPD8C ECAD Model
XC1718DPD8C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 18.144 kbit | |
| Memory Width | 1 | |
| Organization | 18144X1 | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Power Supplies | 5 V | |
| Clock Frequency-Max (fCLK) | 5 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 18144 | |
| Number of Words | 18.144 k | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 1.5 mA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Seated Height-Max | 4.5974 mm | |
| Length | 9.3599 mm | |
| Width | 7.62 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | PLASTIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC1718DPD8C Datasheet Download
XC1718DPD8C Overview
The XC1718DPD8C chip model is a high-performance, low-power, 8-bit CMOS microcontroller designed by Xilinx for advanced communication systems. It is specifically designed to meet the needs of various embedded applications such as industrial control, automation, automotive, and consumer electronics.
The XC1718DPD8C chip model is designed to provide a wide range of features and benefits, including high-speed operation, low power consumption, and low-cost operation. It is also designed to be highly reliable, with a built-in error-correction mechanism to ensure data accuracy and integrity. Additionally, the chip model has built-in features such as memory protection, interrupt handling, and peripheral support.
The XC1718DPD8C chip model is also designed to be easily upgradable and expandable. It can be used with a variety of different communication protocols, such as Ethernet, USB, and CAN. Additionally, the chip model offers support for a wide range of peripheral devices, such as LCDs, LEDs, and sensors. This allows for the development of advanced communication systems and applications.
In terms of applications, the XC1718DPD8C chip model can be used for the development and popularization of future intelligent robots. It can be used to control motors, servos, and other components, as well as to process data and make decisions. To use the model effectively, technical talents such as engineers and programmers are needed.
In conclusion, the XC1718DPD8C chip model is a powerful and reliable tool for advanced communication systems. It is designed to be easily upgradable and expandable, and its features and benefits make it a great choice for the development of intelligent robots. With the right technical talents, this chip model can be used to create powerful and efficient applications.
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4,821 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1.4508 | $1.4508 |
| 10+ | $1.4352 | $14.3520 |
| 100+ | $1.3572 | $135.7200 |
| 1000+ | $1.2792 | $639.6000 |
| 10000+ | $1.1700 | $1,170.0000 |
| The price is for reference only, please refer to the actual quotation! | ||