
AMD Xilinx
XC17128DPD8I
XC17128DPD8I ECAD Model
XC17128DPD8I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Memory Density | 131.072 kbit | |
Memory Width | 1 | |
Organization | 128KX1 | |
Supply Voltage-Nom (Vsup) | 5 V | |
Power Supplies | 5 V | |
Clock Frequency-Max (fCLK) | 12.5 MHz | |
Memory IC Type | CONFIGURATION MEMORY | |
I/O Type | COMMON | |
Number of Functions | 1 | |
Number of Words Code | 128000 | |
Number of Words | 131.072 k | |
Operating Mode | SYNCHRONOUS | |
Output Characteristics | 3-STATE | |
Parallel/Serial | SERIAL | |
Standby Current-Max | 50 µA | |
Supply Current-Max | 10 µA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PDIP-T8 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Surface Mount | NO | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Seated Height-Max | 4.5974 mm | |
Length | 9.3599 mm | |
Width | 7.62 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP8,.3 | |
Pin Count | 8 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 |
XC17128DPD8I Datasheet Download
XC17128DPD8I Overview
The chip model XC17128DPD8I is a new development in the field of semiconductor technology and is designed to meet the growing needs of the industry. It is a high-performance, versatile chip model that offers a range of features and benefits to users. The unique design of the chip model XC17128DPD8I makes it an ideal choice for a variety of applications, from consumer electronics and automotive to industrial and medical.
The chip model XC17128DPD8I is designed to provide a high-performance, low-power solution for a range of applications. It is a single-chip model that combines a wide range of features and benefits, including a high-speed, low-power CPU, a large memory capacity, and a wide range of peripherals. It is ideal for applications that require high performance and low power consumption, such as automotive, industrial, and medical applications.
The expected demand for the chip model XC17128DPD8I is expected to increase in the future, as more and more applications require its features and benefits. The chip model is designed to be upgradeable, so it can be used in advanced communication systems and other applications. The chip model is also designed to be compatible with a wide range of operating systems and platforms, so it can be used in a variety of applications.
The product description and specific design requirements of the chip model XC17128DPD8I are outlined in detail in the product documentation. The product documentation contains detailed information about the chip model's features, design specifications, and performance characteristics. It also includes a list of compatible operating systems and platforms, as well as a list of compatible peripherals.
The chip model XC17128DPD8I has been tested in a variety of applications and case studies. The test results have shown that the chip model is reliable, efficient, and capable of meeting the requirements of a wide range of applications. As with any technology, there are some precautions that should be taken when using the chip model. For example, it is important to ensure that the chip model is properly installed and configured, and that the operating system and platform are compatible with the chip model.
In conclusion, the chip model XC17128DPD8I is an advanced, high-performance, low-power chip model that can be used in a variety of applications. It is designed to be upgradeable, so it can be used in advanced communication systems and other applications. The expected demand for the chip model is expected to increase in the future, and it is designed to be compatible with a wide range of operating systems and platforms. The product documentation contains detailed information about the chip model's features, design specifications, and performance characteristics, as well as a list of compatible peripherals. The chip model has been tested in a variety of applications and case studies, and the test results have shown that it is reliable, efficient, and capable of meeting the requirements of a wide range of applications.
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3,333 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $133.5582 | $133.5582 |
10+ | $132.1221 | $1,321.2212 |
100+ | $124.9416 | $12,494.1570 |
1000+ | $117.7610 | $58,880.5100 |
10000+ | $107.7083 | $107,708.2500 |
The price is for reference only, please refer to the actual quotation! |