XC17128DPD8I
XC17128DPD8I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC17128DPD8I


XC17128DPD8I
F20-XC17128DPD8I
Active
CMOS, DIP, DIP8,.3
DIP, DIP8,.3

XC17128DPD8I ECAD Model


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XC17128DPD8I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Memory Density 131.072 kbit
Memory Width 1
Organization 128KX1
Supply Voltage-Nom (Vsup) 5 V
Power Supplies 5 V
Clock Frequency-Max (fCLK) 12.5 MHz
Memory IC Type CONFIGURATION MEMORY
I/O Type COMMON
Number of Functions 1
Number of Words Code 128000
Number of Words 131.072 k
Operating Mode SYNCHRONOUS
Output Characteristics 3-STATE
Parallel/Serial SERIAL
Standby Current-Max 50 µA
Supply Current-Max 10 µA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Technology CMOS
Temperature Grade INDUSTRIAL
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Surface Mount NO
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Seated Height-Max 4.5974 mm
Length 9.3599 mm
Width 7.62 mm
Ihs Manufacturer XILINX INC
Part Package Code DIP
Package Description DIP, DIP8,.3
Pin Count 8
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.51

XC17128DPD8I Datasheet Download


XC17128DPD8I Overview



The chip model XC17128DPD8I is a new development in the field of semiconductor technology and is designed to meet the growing needs of the industry. It is a high-performance, versatile chip model that offers a range of features and benefits to users. The unique design of the chip model XC17128DPD8I makes it an ideal choice for a variety of applications, from consumer electronics and automotive to industrial and medical.


The chip model XC17128DPD8I is designed to provide a high-performance, low-power solution for a range of applications. It is a single-chip model that combines a wide range of features and benefits, including a high-speed, low-power CPU, a large memory capacity, and a wide range of peripherals. It is ideal for applications that require high performance and low power consumption, such as automotive, industrial, and medical applications.


The expected demand for the chip model XC17128DPD8I is expected to increase in the future, as more and more applications require its features and benefits. The chip model is designed to be upgradeable, so it can be used in advanced communication systems and other applications. The chip model is also designed to be compatible with a wide range of operating systems and platforms, so it can be used in a variety of applications.


The product description and specific design requirements of the chip model XC17128DPD8I are outlined in detail in the product documentation. The product documentation contains detailed information about the chip model's features, design specifications, and performance characteristics. It also includes a list of compatible operating systems and platforms, as well as a list of compatible peripherals.


The chip model XC17128DPD8I has been tested in a variety of applications and case studies. The test results have shown that the chip model is reliable, efficient, and capable of meeting the requirements of a wide range of applications. As with any technology, there are some precautions that should be taken when using the chip model. For example, it is important to ensure that the chip model is properly installed and configured, and that the operating system and platform are compatible with the chip model.


In conclusion, the chip model XC17128DPD8I is an advanced, high-performance, low-power chip model that can be used in a variety of applications. It is designed to be upgradeable, so it can be used in advanced communication systems and other applications. The expected demand for the chip model is expected to increase in the future, and it is designed to be compatible with a wide range of operating systems and platforms. The product documentation contains detailed information about the chip model's features, design specifications, and performance characteristics, as well as a list of compatible peripherals. The chip model has been tested in a variety of applications and case studies, and the test results have shown that it is reliable, efficient, and capable of meeting the requirements of a wide range of applications.



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Unit Price: $143.611
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $133.5582 $133.5582
10+ $132.1221 $1,321.2212
100+ $124.9416 $12,494.1570
1000+ $117.7610 $58,880.5100
10000+ $107.7083 $107,708.2500
The price is for reference only, please refer to the actual quotation!

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