AMD Xilinx
XC1701LPC20C
XC1701LPC20C ECAD Model
XC1701LPC20C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Memory Density | 1.0486 Mbit | |
| Memory Width | 1 | |
| Organization | 1MX1 | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Power Supplies | 3.3 V | |
| Clock Frequency-Max (fCLK) | 15 MHz | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | |
| I/O Type | COMMON | |
| Number of Functions | 1 | |
| Number of Words Code | 1000000 | |
| Number of Words | 1.0486 M | |
| Operating Mode | SYNCHRONOUS | |
| Output Characteristics | 3-STATE | |
| Parallel/Serial | SERIAL | |
| Standby Current-Max | 50 µA | |
| Supply Current-Max | 10 µA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| JESD-30 Code | S-PQCC-J20 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 20 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC20,.4SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Seated Height-Max | 4.572 mm | |
| Length | 8.9662 mm | |
| Width | 8.9662 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QLCC | |
| Package Description | PLASTIC, LCC-20 | |
| Pin Count | 20 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 |
XC1701LPC20C Datasheet Download
XC1701LPC20C Overview
The XC1701LPC20C chip model is a powerful and versatile microcontroller that is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is equipped with a high-level hardware description language (HDL) to help users easily and quickly design and program their own customized applications. This chip has the potential to be used in networks and intelligent scenarios, making it an ideal choice for the fully intelligent systems of the future.
The XC1701LPC20C chip model is designed with a wide range of features and capabilities. It offers a high-speed CPU, onboard memory, and a variety of peripheral interfaces, including Ethernet, USB, and CAN. It also includes a wide range of peripheral modules, such as ADC, DAC, Timer, and UART. The chip also has a multi-core architecture and can support multiple operating systems, making it suitable for embedded applications.
In addition to its features and capabilities, the XC1701LPC20C chip model also offers a wide range of design options and customization. It can be used for a variety of applications, including industrial automation, automotive, medical, and consumer products. It also supports a variety of programming languages, including C, C++, and assembly. With its wide range of features and capabilities, the XC1701LPC20C chip model is a great choice for any application.
When designing and developing applications with the XC1701LPC20C chip model, it is important to keep in mind the product design requirements and actual case studies. It is important to ensure that the design meets the specific requirements of the application, such as power consumption, performance, and cost. Additionally, it is important to consider the potential risks and precautions associated with the application, such as data security, reliability, and scalability.
The XC1701LPC20C chip model is a powerful and versatile microcontroller that is ideal for high-performance digital signal processing, embedded processing, and image processing. With its wide range of features and capabilities, it has the potential to be used in networks and intelligent scenarios, making it an ideal choice for the fully intelligent systems of the future. When designing and developing applications with the XC1701LPC20C chip model, it is important to keep in mind the product design requirements and actual case studies and to consider the potential risks and precautions associated with the application.
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5,662 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7.0710 | $7.0710 |
| 10+ | $6.9949 | $69.9494 |
| 100+ | $6.6148 | $661.4784 |
| 1000+ | $6.2346 | $3,117.3120 |
| 10000+ | $5.7024 | $5,702.4000 |
| The price is for reference only, please refer to the actual quotation! | ||