AMD Xilinx
XAZU7EV-1FBVB900Q
XAZU7EV-1FBVB900Q ECAD Model
XAZU7EV-1FBVB900Q Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Bus Compatibility | CAN, I2C, SPI, UART | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.97 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | unknown | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XAZU7EV-1FBVB900Q Datasheet Download
XAZU7EV-1FBVB900Q Overview
The chip model XAZU7EV-1FBVB900Q is a powerful and versatile processor that is capable of powering a wide range of applications. It is a multi-core processor with a high performance-to-power ratio and advanced power management features. It is designed to meet the needs of the most demanding applications, such as high-end gaming, virtual reality, artificial intelligence, and robotics.
The chip model XAZU7EV-1FBVB900Q is a great choice for current and future applications. It is a reliable and reliable processor that is capable of handling complex tasks efficiently. It is also energy-efficient, making it ideal for applications that require low power consumption. With its advanced features, the chip model XAZU7EV-1FBVB900Q can be used in a variety of applications, from desktops and laptops to embedded systems and mobile devices.
The chip model XAZU7EV-1FBVB900Q is designed to be future-proof, allowing for easy upgrades and scalability. It is capable of supporting new technologies and applications as they become available. This makes it an ideal choice for applications that require the latest technologies. It is also compatible with a wide range of operating systems, making it a great choice for developers and users alike.
The chip model XAZU7EV-1FBVB900Q is also an excellent choice for the development and popularization of future intelligent robots. It is capable of powering advanced communication systems and has the potential to be used in a wide range of applications. It is also capable of supporting the latest technologies, making it an ideal choice for developers and users.
In order to use the chip model XAZU7EV-1FBVB900Q effectively, certain technical talents are required. These include knowledge of the processor architecture, programming languages, and operating systems. Additionally, knowledge of artificial intelligence, robotics, and other advanced technologies is also necessary. With the right combination of technical skills, the chip model XAZU7EV-1FBVB900Q can be used to power a wide range of applications and can be used to develop and popularize future intelligent robots.
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4,598 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,565.0129 | $4,565.0129 |
| 10+ | $4,515.9267 | $45,159.2672 |
| 100+ | $4,270.4959 | $427,049.5920 |
| 1000+ | $4,025.0651 | $2,012,532.5600 |
| 10000+ | $3,681.4620 | $3,681,462.0000 |
| The price is for reference only, please refer to the actual quotation! | ||