AMD Xilinx
XAZU7EV-1FBVB900I
XAZU7EV-1FBVB900I ECAD Model
XAZU7EV-1FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Bus Compatibility | CAN, I2C, SPI, UART | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.97 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | unknown | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XAZU7EV-1FBVB900I Datasheet Download
XAZU7EV-1FBVB900I Overview
The chip model XAZU7EV-1FBVB900I is a revolutionary model that has been designed to meet the demands of the ever-evolving world of technology. It is a powerful and versatile chip model that has the capability to be used in a variety of applications. It is designed to be highly reliable and efficient, and it is capable of functioning in a variety of environments.
The chip model XAZU7EV-1FBVB900I has been designed to meet the needs of the modern world. It is capable of supporting the latest technologies, such as 5G networks, and it is able to provide high-speed data transfer. It is also capable of supporting the latest communication systems, such as Wi-Fi and Bluetooth. This makes it a great choice for businesses and consumers alike.
The chip model XAZU7EV-1FBVB900I is also designed to be highly reliable and efficient in a variety of environments. It is able to support a variety of intelligent scenarios, such as machine learning and artificial intelligence. This makes it a great choice for businesses and consumers who are looking to make the most out of their technology.
In the future, the chip model XAZU7EV-1FBVB900I is likely to be an important part of the development of the industry. It is likely to be used in a variety of applications, including advanced communication systems and networks. It is also likely to be used in the era of fully intelligent systems, as it is capable of supporting the latest technologies.
Overall, the chip model XAZU7EV-1FBVB900I is a revolutionary model that has been designed to meet the demands of the ever-evolving world of technology. It is a powerful and versatile chip model that has the capability to be used in a variety of applications. It is designed to be highly reliable and efficient, and it is capable of functioning in a variety of environments. It is also capable of supporting the latest technologies, such as 5G networks, and it is likely to be an important part of the development of the industry in the future.
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5,258 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,634.3403 | $2,634.3403 |
| 10+ | $2,606.0141 | $26,060.1408 |
| 100+ | $2,464.3829 | $246,438.2880 |
| 1000+ | $2,322.7517 | $1,161,375.8400 |
| 10000+ | $2,124.4680 | $2,124,468.0000 |
| The price is for reference only, please refer to the actual quotation! | ||