XAZU3EG-1SBVA484Q
XAZU3EG-1SBVA484Q
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rohs

AMD Xilinx

XAZU3EG-1SBVA484Q


XAZU3EG-1SBVA484Q
F20-XAZU3EG-1SBVA484Q
Active
CMOS, FCBGA-484
FCBGA-484

XAZU3EG-1SBVA484Q ECAD Model


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XAZU3EG-1SBVA484Q Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Temperature Grade AUTOMOTIVE
JESD-30 Code S-PBGA-B484
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Seated Height-Max 2.61 mm
Width 19 mm
Length 19 mm
Ihs Manufacturer XILINX INC
Package Description FCBGA-484
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XAZU3EG-1SBVA484Q Datasheet Download


XAZU3EG-1SBVA484Q Overview



The chip model XAZU3EG-1SBVA484Q is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing and image processing. It is designed to be used with the HDL (Hardware Description Language) language and provides a range of features and capabilities that make it suitable for a variety of applications.


The original design intention of the chip model XAZU3EG-1SBVA484Q was to provide a powerful and efficient processor for high-performance digital signal processing, embedded processing and image processing. It is capable of running multiple tasks concurrently, allowing for multitasking and improved efficiency. The chip also features a wide range of features, including multiple clock speeds, multiple cores, multiple memory types, and multiple I/O ports. Furthermore, the chip is designed to be easily upgradable, allowing for future upgrades and improvements.


The product description and specific design requirements of the chip model XAZU3EG-1SBVA484Q are outlined in the product’s datasheet. The datasheet provides detailed information on the chip’s features, capabilities and design parameters. It also outlines the specific design requirements and provides guidance on how to use the chip in various applications.


The chip model XAZU3EG-1SBVA484Q has been used in a variety of applications, including advanced communication systems. It has been used to develop high-speed data transmission systems, as well as advanced communication systems for the military and aerospace industries. In addition, the chip has been used in medical imaging systems and in industrial automation systems.


When using the chip model XAZU3EG-1SBVA484Q, it is important to ensure that the design meets the product’s specifications and requirements. It is also important to ensure that the chip is correctly integrated into the system, as the chip’s performance can be affected by other components in the system. Furthermore, the chip should be tested and verified before deployment, to ensure that it is working as expected.


In conclusion, the chip model XAZU3EG-1SBVA484Q is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing and image processing. It is capable of running multiple tasks concurrently, and is designed to be easily upgradable. It has been used in a variety of applications, including advanced communication systems, and it is important to ensure that the design meets the product’s specifications and requirements.



4,673 In Stock


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Unit Price: $812.436
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Pricing (USD)

QTY Unit Price Ext Price
1+ $755.5655 $755.5655
10+ $747.4411 $7,474.4112
100+ $706.8193 $70,681.9320
1000+ $666.1975 $333,098.7600
10000+ $609.3270 $609,327.0000
The price is for reference only, please refer to the actual quotation!

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