AMD Xilinx
XA7Z030-1FBV484Q
XA7Z030-1FBV484Q ECAD Model
XA7Z030-1FBV484Q Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| JESD-30 Code | S-PBGA-B484 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Screening Level | AEC-Q100 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XA7Z030-1FBV484Q Datasheet Download
XA7Z030-1FBV484Q Overview
The XA7Z030-1FBV484Q chip model is a powerful processor designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with HDL language and provides an optimal performance in these applications.
The chip model is designed to be able to handle complex calculations and tasks quickly and efficiently. It also has the capability to support advanced communication systems and the possibility of future upgrades. The design intention of the chip model was to provide a platform that can be used for various applications and with the ability to be upgraded in the future.
The industry trends for the chip model XA7Z030-1FBV484Q are constantly changing and evolving. This is due to the ever-changing needs of the applications and technologies that the chip model is used for. As the technologies and applications evolve, the chip model may require the support of new technologies in order to keep up with the industry trends.
The chip model XA7Z030-1FBV484Q is a powerful processor that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with HDL language and provides an optimal performance in these applications. The original design intention of the chip model was to provide a platform that can be used for various applications and with the ability to be upgraded in the future. The industry trends for the chip model are constantly changing and evolving, and the application environment may require the support of new technologies in order to keep up with the industry trends. The chip model is a powerful processor that is capable of handling complex calculations and tasks quickly and efficiently, and it has the capability to support advanced communication systems and the possibility of future upgrades.
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2,445 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $374.6062 | $374.6062 |
| 10+ | $370.5782 | $3,705.7821 |
| 100+ | $350.4381 | $35,043.8088 |
| 1000+ | $330.2980 | $165,148.9840 |
| 10000+ | $302.1018 | $302,101.8000 |
| The price is for reference only, please refer to the actual quotation! | ||