AMD Xilinx
XA7Z030-1FBG484Q
XA7Z030-1FBG484Q ECAD Model
XA7Z030-1FBG484Q Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Surface Mount | YES | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Power Supplies | 1,1.8 V | |
| Temperature Grade | AUTOMOTIVE | |
| UV Erasable | N | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Screening Level | AEC-Q100 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.54 mm | |
| Width | 23 mm | |
| Length | 23 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XA7Z030-1FBG484Q Datasheet Download
XA7Z030-1FBG484Q Overview
The chip model XA7Z030-1FBG484Q is a powerful tool that has revolutionized the world of technology, making it possible to build more efficient and advanced systems. This chip model is capable of handling a wide range of applications, including embedded systems, communications, and networks. It is also suitable for developing intelligent systems, robots, and other applications.
The industry trends of the chip model XA7Z030-1FBG484Q and the future development of related industries depend on the specific technologies that are needed. For example, the chip model XA7Z030-1FBG484Q is capable of handling a wide range of applications, including embedded systems, communications, and networks. It is also suitable for developing intelligent systems, robots, and other applications. Therefore, the chip model XA7Z030-1FBG484Q could be used in the future for networks and intelligent scenarios.
The chip model XA7Z030-1FBG484Q can also be applied to the development and popularization of future intelligent robots. It is capable of providing the necessary computing power for robots to be able to move, sense, and interact with their environment. In addition, the chip model XA7Z030-1FBG484Q can also be used to develop and deploy algorithms that enable robots to learn and make decisions.
In order to use the chip model XA7Z030-1FBG484Q effectively, certain technical talents are needed. These include knowledge in the areas of embedded systems, communications, and networks. In addition, knowledge in the areas of robotics, artificial intelligence, and machine learning is also necessary. Furthermore, knowledge in the areas of software engineering, algorithms, and data structures is also essential.
In conclusion, the chip model XA7Z030-1FBG484Q is a powerful tool that can be used in the future for networks and intelligent scenarios. It can also be applied to the development and popularization of future intelligent robots. In order to use the chip model XA7Z030-1FBG484Q effectively, certain technical talents are needed in the areas of embedded systems, communications, robotics, artificial intelligence, and machine learning.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||