
AMD Xilinx
XA7Z030-1FBG484I
XA7Z030-1FBG484I ECAD Model
XA7Z030-1FBG484I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Surface Mount | YES | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Power Supplies | 1,1.8 V | |
UV Erasable | N | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 250 | |
Screening Level | AEC-Q100 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 2.54 mm | |
Width | 23 mm | |
Length | 23 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA-484 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.31.00.01 |
XA7Z030-1FBG484I Datasheet Download
XA7Z030-1FBG484I Overview
The XA7Z030-1FBG484I chip model is a revolutionary new product that has been developed by the leading chip manufacturer, Xilinx. It is a highly advanced and powerful processor that is designed to meet the needs of the most demanding applications. The chip model is based on the latest Xilinx Zynq-7000 All Programmable System-on-Chip (AP SoC) architecture, and it is the first to offer a combination of the ARM dual-core Cortex-A9 processor and the Xilinx 7-series FPGA fabric.
The XA7Z030-1FBG484I chip model is a powerful and versatile processor that offers a wide range of advantages for a variety of applications. It provides a high level of performance, with up to 1.5 GHz of processing power and up to 1 GB of on-chip memory. It also offers a wide range of communication interfaces, including Ethernet, USB, and PCI Express. It is also capable of supporting multiple operating systems, such as Linux, Windows, and VxWorks.
Due to the high performance and versatility of the XA7Z030-1FBG484I chip model, it is expected to be in high demand in various industries in the future. It is well-suited for use in data centers, telecommunications, and other applications that require high performance and low power consumption. It is also expected to be used in embedded systems, medical devices, and other applications that require a reliable and high-performance processor.
The original design intention of the XA7Z030-1FBG484I chip model was to provide a powerful and versatile processor that could meet the needs of the most demanding applications. It is designed to be easily upgradable and customizable, allowing users to tailor the processor to their specific needs. It is also designed to be highly reliable and efficient, with a low power consumption rate and a long lifetime.
As technology advances, the XA7Z030-1FBG484I chip model will be able to take advantage of new technologies and features. It is possible that future upgrades may include support for new communication protocols, improved memory and storage capabilities, and even the ability to support artificial intelligence. This could open up a whole new range of possibilities for the chip model, and it is likely that it will continue to be in high demand in the future.
The XA7Z030-1FBG484I chip model is also capable of being applied to the development and popularization of future intelligent robots. It is powerful enough to handle the complex calculations and algorithms necessary for the operation of robots, and its reliability and low power consumption make it ideal for use in robotics applications. In order to use the chip model effectively, it is important to have a good understanding of the Xilinx Zynq-7000 All Programmable System-on-Chip (AP SoC) architecture, as well as knowledge of C programming language and embedded systems.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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