XA6SLX75T-2FGG484Q

The XA6SLX75T-2FGG484Q is an FPGA (Field Programmable Gate Array) chip from Xilinx Corporation. It is a low-power, low-cost, high-performance device designed for embedded applications. It has a total of 484 I/Os (Input/Outputs) and is housed in a low-profile, 1.27mm pitch, 484-pin Flip-Chip Ball Grid Array (FCBGA) package.

The chip offers a wide range of features, including support for up to 10,000 logic cells, 18Kbits of block RAM, and up to 8 DSP slices. It also provides up to 2.25Mbits of embedded memory, including 1.5Mbits of distributed RAM and 750Kbits of distributed ROM. It has a maximum clock frequency of 200MHz, and can be used in multiple clock domains and with multiple clock sources.

The XA6SLX75T-2FGG484Q is ideal for embedded applications such as industrial automation, automotive, aerospace, medical, and military applications. It is also suitable for applications that require high-speed and low-power, such as image processing, video streaming, and high-speed communications.

In summary, the XA6SLX75T-2FGG484Q is a low-cost, low-power, high-performance FPGA chip from Xilinx Corporation. It offers a wide range of features and is suitable for a variety of embedded applications, including industrial automation, automotive, aerospace, medical, and military applications. It is also suitable for applications that require high-speed and low-power, such as image processing, video streaming, and high-speed communications.