XA6SLX75-3FGG484I
XA6SLX75-3FGG484I
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rohs

AMD Xilinx

XA6SLX75-3FGG484I


XA6SLX75-3FGG484I
F20-XA6SLX75-3FGG484I
Active
FIELD PROGRAMMABLE GATE ARRAY
-

XA6SLX75-3FGG484I ECAD Model


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XA6SLX75-3FGG484I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Number of Inputs 280
Number of Outputs 280
Number of Logic Cells 74637
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100
Package Shape SQUARE
Clock Frequency-Max 62.5 MHz
Power Supplies 1.2,2.5/3.3 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XA6SLX75-3FGG484I Datasheet Download


XA6SLX75-3FGG484I Overview



The chip model XA6SLX75-3FGG484I has been a major player in the semiconductor industry for many years, and the trends of its usage and application have been constantly evolving. This chip model is a Field Programmable Gate Array (FPGA) device, which is a type of integrated circuit that can be programmed to perform specific tasks. Its main advantages include its high performance, flexibility, and scalability.


In order to understand the current trends in the industry and the potential applications of the chip model XA6SLX75-3FGG484I, it is important to understand the specific design requirements and product description. This chip model is based on the Xilinx Spartan-6 FPGA architecture and is designed for use in high-end applications. It features a total of 484 I/O pins, with a maximum operating frequency of 250MHz. It has a wide variety of features such as high-speed transceivers, memory controllers, and advanced logic blocks.


The chip model XA6SLX75-3FGG484I can be used in a variety of applications, such as in aerospace, automotive, industrial, and medical systems. Additionally, it can be used in the development and popularization of future intelligent robots. This chip model is highly suited for this purpose as it is capable of supporting complex algorithms and can be programmed to perform specific tasks. In order to use the chip model XA6SLX75-3FGG484I effectively, technical talents such as software engineers, hardware engineers, and robotics engineers are required.


The application environment of the chip model XA6SLX75-3FGG484I may require the support of new technologies. In order to understand the specific technologies that are needed, it is important to consider actual case studies and take into account the various precautions that are necessary for the successful implementation of the chip model. Additionally, it is important to remain aware of the various industry trends and future developments in order to ensure that the chip model is being used in the most effective manner.


Overall, the chip model XA6SLX75-3FGG484I is an extremely versatile and powerful device that can be used in a variety of applications. In order to use it effectively, it is important to understand the specific design requirements and product description, as well as the potential applications and the necessary technical talents. Additionally, it is important to remain informed of the current industry trends and future developments in order to ensure that the chip model is being used in the most effective manner.



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Unit Price: $102.032
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Pricing (USD)

QTY Unit Price Ext Price
1+ $94.8898 $94.8898
10+ $93.8694 $938.6944
100+ $88.7678 $8,876.7840
1000+ $83.6662 $41,833.1200
10000+ $76.5240 $76,524.0000
The price is for reference only, please refer to the actual quotation!

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