XA6SLX75-3CSG484Q

The XA6SLX75-3CSG484Q chip is an FPGA (Field Programmable Gate Array) from Xilinx Inc. It is a low-cost, low-power, high-performance device that can be used for a variety of applications. The device is based on the Spartan-6 LX75 FPGA architecture and has a total of 3,456 logic slices, with each slice containing four 6-input look-up tables. It also has two dedicated multiplier blocks, two dedicated clock management blocks and four dedicated block RAMs.

The device supports a wide range of I/O standards, including LVDS, LVCMOS, SSTL, HSTL, and GTL. It also supports a variety of data rates, including up to 8 Gbps. It is designed to operate at a maximum temperature of 85°C.

The XA6SLX75-3CSG484Q chip can be used for a variety of applications, such as communication systems, automotive systems, industrial automation, medical imaging, and aerospace applications. It is ideal for applications that require low power consumption, high performance, and flexibility.

The device is packaged in a small, 484-pin Flip-Chip Ball Grid Array (FCBGA). It is RoHS compliant and is available in both commercial and industrial temperature ranges. The device can be used with the Xilinx Vivado Design Suite, which provides a comprehensive set of design tools for designing with the XA6SLX75-3CSG484Q chip.