XA6SLX75-2CSG484I
XA6SLX75-2CSG484I
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rohs

AMD Xilinx

XA6SLX75-2CSG484I


XA6SLX75-2CSG484I
F20-XA6SLX75-2CSG484I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
BGA

XA6SLX75-2CSG484I ECAD Model


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XA6SLX75-2CSG484I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Number of Inputs 328
Number of Outputs 328
Number of Logic Cells 74637
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 667 MHz
Power Supplies 1.2,1.2/3.3,2.5/3.3 V
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA484,22X22,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XA6SLX75-2CSG484I Datasheet Download


XA6SLX75-2CSG484I Overview



The chip model XA6SLX75-2CSG484I is a powerful and versatile chip that is designed for a wide range of applications. It is a high-performance, low-power, multi-core, multi-threaded processor that can be used in a variety of applications such as embedded systems, communications, security, and networking. It is designed to be highly configurable and can be adapted to meet the needs of a variety of applications.


The XA6SLX75-2CSG484I chip model is based on the Xilinx Spartan-6 FPGA family and is designed to provide a high level of performance and flexibility. It is designed to be highly scalable and can be tailored to meet the needs of a variety of applications. It is also designed to be highly configurable and can be adapted to meet the needs of a variety of applications. The chip model also includes a range of features such as a high-speed, low-power processor core, multiple memory interfaces, and an integrated memory controller.


The XA6SLX75-2CSG484I chip model is designed to be used in a wide range of applications, from embedded systems to communications systems. It is designed to be highly configurable and can be adapted to meet the needs of a variety of applications. It is also designed to be highly scalable and can be tailored to meet the needs of a variety of applications. The chip model also includes a range of features such as a high-speed, low-power processor core, multiple memory interfaces, and an integrated memory controller.


The XA6SLX75-2CSG484I chip model has been designed to be used in a wide range of applications, from embedded systems to communications systems. It is designed to provide a high level of performance and flexibility. It is also designed to be highly configurable and can be adapted to meet the needs of a variety of applications. The chip model also includes a range of features such as a high-speed, low-power processor core, multiple memory interfaces, and an integrated memory controller.


When it comes to industry trends of the chip model XA6SLX75-2CSG484I and the future development of related industries, it depends on what specific technologies are needed. As for the original design intention of the chip model XA6SLX75-2CSG484I and the possibility of future upgrades, it is designed to be highly configurable and can be adapted to meet the needs of a variety of applications. It is also designed to be highly scalable and can be tailored to meet the needs of a variety of applications.


The product description and specific design requirements of the chip model XA6SLX75-2CSG484I, along with actual case studies and precautions, can be found in the product documentation. The product documentation outlines the features and capabilities of the chip model and provides information on how to use it in a variety of applications. It also provides information on the design requirements and precautions to be taken when using the chip model.


In conclusion, the chip model XA6SLX75-2CSG484I is a powerful and versatile chip that is designed for a wide range of applications. It is designed to be highly configurable and can be adapted to meet the needs of a variety of applications. It is also designed to be highly scalable and can be tailored to meet the needs of a variety of applications. When it comes to industry trends of the chip model and the future development of related industries, it depends on what specific technologies are needed. The product description and specific design requirements of the chip model, along with actual case studies and precautions, can be found in the product documentation.



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