XA6SLX45T-3FGG484C
XA6SLX45T-3FGG484C
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rohs

AMD Xilinx

XA6SLX45T-3FGG484C


XA6SLX45T-3FGG484C
F20-XA6SLX45T-3FGG484C
Active
FIELD PROGRAMMABLE GATE ARRAY
-

XA6SLX45T-3FGG484C ECAD Model


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XA6SLX45T-3FGG484C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Terminal Finish TIN SILVER COPPER
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XA6SLX45T-3FGG484C Datasheet Download


XA6SLX45T-3FGG484C Overview



The XA6SLX45T-3FGG484C chip model is a powerful and versatile chip that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, allowing engineers to use this powerful chip model to create complex designs.


The XA6SLX45T-3FGG484C chip model is equipped with a variety of features that make it a great choice for a variety of applications. It has a high-speed logic array, a large number of I/O pins, and a wide range of power-saving features. It also has a low-power sleep mode that can be used for energy-efficient designs. Additionally, the chip model offers a range of advanced features, such as a high-speed memory controller and a large number of peripherals.


The XA6SLX45T-3FGG484C chip model is expected to be in high demand in the coming years, due to its versatile features and low power consumption. It is ideal for a wide range of applications, from consumer electronics to industrial applications. It is also suitable for use in medical and aerospace applications, due to its high-speed logic array and large number of I/O pins.


When designing with the XA6SLX45T-3FGG484C chip model, engineers should consider the specific design requirements of the chip. These requirements include the type of I/O pins, the number of logic elements, and the power supply voltage. Additionally, engineers should consider the specific design goals of the project, such as the speed and power consumption requirements. Finally, engineers should also consider any safety and reliability requirements, such as the use of error detection and correction features.


To illustrate the use of the XA6SLX45T-3FGG484C chip model, there are a number of case studies available. These case studies provide detailed information about the design process, as well as the results achieved. Additionally, these case studies can provide helpful guidance on how to design with the chip model.


Finally, when using the XA6SLX45T-3FGG484C chip model, engineers should take the necessary precautions. This includes ensuring the correct power supply voltage and ensuring the correct number of I/O pins. Additionally, engineers should ensure that the design meets the safety and reliability requirements. This can be done by using error detection and correction features, as well as by testing the design thoroughly.


In conclusion, the XA6SLX45T-3FGG484C chip model is a powerful and versatile chip that is suitable for a variety of applications. It is expected to be in high demand in the future, due to its versatile features and low power consumption. When designing with the chip model, engineers should consider the specific design requirements, as well as any safety and reliability requirements. Additionally, there are a number of case studies available that can provide helpful guidance on how to design with the chip model. Finally, engineers should take the necessary precautions when using the chip model, such as ensuring the correct power supply voltage and ensuring the correct number of I/O pins.



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