
AMD Xilinx
XA6SLX45T-3FG484C
XA6SLX45T-3FG484C ECAD Model
XA6SLX45T-3FG484C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XA6SLX45T-3FG484C Datasheet Download
XA6SLX45T-3FG484C Overview
The XA6SLX45T-3FG484C is a chip model designed by Xilinx, Inc. to meet a variety of needs in the field of advanced communication systems. It is a single-chip solution that integrates high-performance logic, memory, and digital signal processing (DSP) capabilities. This chip model is ideal for applications such as wireless and wired communications, video and image processing, and embedded control systems.
The original design intention of the XA6SLX45T-3FG484C was to provide a robust and reliable solution for advanced communication systems. It has the capability to support a wide range of data rates and protocols, making it suitable for a variety of applications. It also offers a high level of flexibility and scalability, allowing users to upgrade the chip model with additional features as needed.
The XA6SLX45T-3FG484C can be used in a variety of advanced communication systems, including 5G networks, WiFi networks, and other wireless networks. It can also be used in intelligent scenarios, such as machine learning and artificial intelligence. The chip model is capable of handling large amounts of data quickly and efficiently, making it suitable for these types of applications.
The product description and specific design requirements of the XA6SLX45T-3FG484C are outlined in the product datasheet. This document outlines the features and specifications of the chip model, as well as any additional requirements for its use. It is important to read and understand the product datasheet before using the chip model to ensure that it meets the specific requirements of the application.
In addition to the product datasheet, there are several case studies available that provide insight into how the XA6SLX45T-3FG484C can be used in various applications. These case studies can provide valuable information on how the chip model can be utilized in different scenarios. It is also important to consider any potential risks associated with using the chip model, such as power consumption and environmental conditions.
The XA6SLX45T-3FG484C is a powerful and reliable chip model that can be used in a variety of advanced communication systems. Its original design intention was to provide a robust and reliable solution for these systems, and it is capable of supporting a wide range of data rates and protocols. It can also be used in intelligent scenarios, such as machine learning and artificial intelligence. It is important to familiarize oneself with the product datasheet and any available case studies before using the chip model, and to consider any potential risks associated with its use.
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