XA6SLX45T-2FG484C
XA6SLX45T-2FG484C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XA6SLX45T-2FG484C


XA6SLX45T-2FG484C
F20-XA6SLX45T-2FG484C
Active
FIELD PROGRAMMABLE GATE ARRAY
BGA

XA6SLX45T-2FG484C ECAD Model


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XA6SLX45T-2FG484C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Terminal Finish Tin/Lead (Sn63Pb37)
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XA6SLX45T-2FG484C Datasheet Download


XA6SLX45T-2FG484C Overview



The XA6SLX45T-2FG484C chip model is an integrated circuit optimized for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in conjunction with the Hardware Description Language (HDL) for programming and control. The chip model is a cost-effective solution for a variety of applications, allowing users to take advantage of its powerful capabilities.


The XA6SLX45T-2FG484C chip model is designed to meet the needs of today's high-performance applications. It is capable of handling complex tasks such as digital signal processing, embedded processing, and image processing. It is an ideal solution for a variety of applications, providing users with an efficient and cost-effective solution.


The industry trends of the XA6SLX45T-2FG484C chip model and the future development of related industries will depend on what specific technologies are needed. As technology advances, the chip model will need to be upgraded to take advantage of new technologies. For example, if the application environment requires the support of new technologies such as 5G networks, then the chip model will need to be upgraded accordingly.


The original design intention of the XA6SLX45T-2FG484C chip model was to provide a cost-effective solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in conjunction with the HDL for programming and control. The chip model is a highly efficient and cost-effective solution for a variety of applications. As technology advances, the chip model can be upgraded to take advantage of new technologies, such as 5G networks. The chip model is also capable of being applied to advanced communication systems, providing users with an efficient and cost-effective solution.



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