AMD Xilinx
XA6SLX25T-3CSG324I
XA6SLX25T-3CSG324I ECAD Model
XA6SLX25T-3CSG324I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 190 | |
| Number of Outputs | 190 | |
| Number of Logic Cells | 24051 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Package Shape | SQUARE | |
| Clock Frequency-Max | 62.5 MHz | |
| Power Supplies | 1.2,2.5/3.3 V | |
| JESD-30 Code | S-PBGA-B324 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 324 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XA6SLX25T-3CSG324I Datasheet Download
XA6SLX25T-3CSG324I Overview
The XA6SLX25T-3CSG324I chip model is a highly advanced integrated circuit that is designed to meet the needs of today’s modern communication systems. It is a low-power, high-performance device that can be used for a variety of applications, including wireless communication, data storage, and signal processing. The chip model is designed to provide a reliable and robust platform for advanced communication systems.
The original design intention of the XA6SLX25T-3CSG324I chip model was to provide a reliable and efficient solution for today’s communication systems. It is designed to be low-power, high-performance, and to provide a reliable platform for advanced communication systems. The chip model is capable of supporting a wide range of communication protocols, including Wi-Fi, Bluetooth, Zigbee, and LTE. It also provides a range of features, such as support for multiple radio frequencies, low latency, high throughput, and low power consumption.
The XA6SLX25T-3CSG324I chip model is highly scalable and can be easily upgraded to support new technologies and applications. It is also capable of supporting a wide range of communication protocols, such as Wi-Fi, Bluetooth, Zigbee, and LTE. The chip model is also capable of supporting multiple radio frequencies, low latency, and high throughput. The chip model is designed to be highly reliable and robust, and is capable of providing a reliable platform for advanced communication systems.
The XA6SLX25T-3CSG324I chip model is also capable of being applied to the development and popularization of future intelligent robots. It is designed to provide a reliable and robust platform for advanced communication systems, and can be used to create robots that are capable of carrying out complex tasks. The chip model is also capable of supporting a wide range of communication protocols, such as Wi-Fi, Bluetooth, Zigbee, and LTE.
In order to use the XA6SLX25T-3CSG324I chip model effectively, it is important to understand the product description and specific design requirements. It is also important to understand the actual case studies and the precautions that need to be taken when using the chip model. In addition, it is important to have a good understanding of the communication protocols, radio frequencies, low latency, and high throughput that the chip model is capable of supporting.
In conclusion, the XA6SLX25T-3CSG324I chip model is a highly advanced integrated circuit that is designed to meet the needs of today’s modern communication systems. It is a low-power, high-performance device that can be used for a variety of applications, including wireless communication, data storage, and signal processing. The chip model is highly scalable and can be easily upgraded to support new technologies and applications. It is also capable of being applied to the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to understand the product description and specific design requirements, as well as the actual case studies and the precautions that need to be taken when using the chip model.
5,335 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $65.0814 | $65.0814 |
| 10+ | $64.3816 | $643.8160 |
| 100+ | $60.8826 | $6,088.2600 |
| 1000+ | $57.3836 | $28,691.8000 |
| 10000+ | $52.4850 | $52,485.0000 |
| The price is for reference only, please refer to the actual quotation! | ||