XA6SLX25-2FTG256I
XA6SLX25-2FTG256I
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rohs

AMD Xilinx

XA6SLX25-2FTG256I


XA6SLX25-2FTG256I
F20-XA6SLX25-2FTG256I
Active
FIELD PROGRAMMABLE GATE ARRAY
BGA256

XA6SLX25-2FTG256I ECAD Model


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XA6SLX25-2FTG256I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Number of Inputs 186
Number of Outputs 186
Number of Logic Cells 24051
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100
Package Shape SQUARE
Clock Frequency-Max 62.5 MHz
Power Supplies 1.2,2.5/3.3 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XA6SLX25-2FTG256I Datasheet Download


XA6SLX25-2FTG256I Overview



The chip model XA6SLX25-2FTG256I is a versatile and powerful integrated circuit developed by Xilinx, Inc. It is designed for advanced applications such as high-speed communication systems, high-performance computing systems, and digital signal processing. The chip model XA6SLX25-2FTG256I is a Field Programmable Gate Array (FPGA) device with a maximum capacity of 256 I/O pins. It is capable of supporting multiple functions and features, such as high-speed on-chip memory, high-performance digital signal processing, and high-speed communication.


The chip model XA6SLX25-2FTG256I is designed to provide a wide range of features and capabilities for advanced applications. It is designed to support multiple standards, such as Ethernet, USB, and PCI Express. It also supports multiple communication protocols, such as Ethernet, USB, and PCI Express. It is also designed to support multiple operating systems, such as Windows, Linux, and Mac OS X.


In terms of industry trends, the chip model XA6SLX25-2FTG256I is designed to be highly compatible with existing technologies, as well as be capable of supporting new technologies as they become available. It is also designed to be easily upgradable to support new features and capabilities as they become available. This allows the chip model XA6SLX25-2FTG256I to remain competitive in the market and provide customers with the latest technology.


The chip model XA6SLX25-2FTG256I has many design requirements that must be taken into consideration when designing a system. These include power consumption, temperature requirements, electrical characteristics, and other design considerations. It is important to ensure that the chip model XA6SLX25-2FTG256I is designed to meet the specific requirements of the application. Additionally, it is important to consider the environment in which the chip model XA6SLX25-2FTG256I will be used, as this will affect the performance of the chip model.


To ensure that the chip model XA6SLX25-2FTG256I is used in the most efficient manner, it is important to consider actual case studies and the precautions that must be taken when using the chip model. This includes ensuring that the chip model is correctly installed and configured, as well as ensuring that the chip model is correctly maintained and serviced. Additionally, it is important to consider the specific needs of the application and ensure that the chip model is compatible with the application.


Overall, the chip model XA6SLX25-2FTG256I is a powerful and versatile integrated circuit that is designed to provide a wide range of features and capabilities for advanced applications. It is designed to be highly compatible with existing technologies, as well as be capable of supporting new technologies as they become available. Additionally, it is important to consider the design requirements, actual case studies, and precautions that must be taken when using the chip model. With these considerations in mind, the chip model XA6SLX25-2FTG256I is an ideal choice for advanced communication systems and other high-performance applications.



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Unit Price: $37.184
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Pricing (USD)

QTY Unit Price Ext Price
1+ $34.5811 $34.5811
10+ $34.2093 $342.0928
100+ $32.3501 $3,235.0080
1000+ $30.4909 $15,245.4400
10000+ $27.8880 $27,888.0000
The price is for reference only, please refer to the actual quotation!

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