XA3SD3400A-4FGG676I
XA3SD3400A-4FGG676I
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AMD Xilinx

XA3SD3400A-4FGG676I


XA3SD3400A-4FGG676I
F20-XA3SD3400A-4FGG676I
Active
IC FPGA 469 I/O 676FBGA
676-FBGA (27x27)

XA3SD3400A-4FGG676I ECAD Model


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XA3SD3400A-4FGG676I Attributes


Type Description Select
Mfr AMD Xilinx
Series Automotive, AEC-Q100, Spartan®-3A DSP XA
Package Tray
Number of LABs/CLBs 5968
Number of Logic Elements/Cells 53712
Total RAM Bits 2322432
Number of I/O 469
Number of Gates 3400000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XA3SD3400A

XA3SD3400A-4FGG676I Datasheet Download


XA3SD3400A-4FGG676I Overview



The XA3SD3400A-4FGG676I is a high-performance, low-power, embedded field programmable gate array (FPGA) chip designed by Xilinx. It is based on the Xilinx Spartan-3A architecture and is fabricated using a 65nm CMOS process. It has a total of 5,760 logic cells, 6,400 Kbits of embedded memory, and 24 DSP slices. It supports up to 4 Gbps of total transceiver bandwidth.


The chip has a wide range of features and capabilities, including a low power, high-performance architecture; support for multiple clock domains; a wide range of I/O options; and the ability to support multiple protocols. It also has advanced power management and clock gating, as well as built-in security features.


The XA3SD3400A-4FGG676I is suitable for a wide range of applications, including embedded systems, industrial automation, medical systems, automotive systems, aerospace systems, and consumer electronics. It is also suitable for high-performance video and image processing, networking, and communications.


Overall, the XA3SD3400A-4FGG676I is a high-performance, low-power, embedded FPGA chip with a wide range of features and capabilities suitable for a variety of applications. It offers an ideal solution for embedded system designers looking for a reliable and cost-effective solution.



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