AMD Xilinx
XA3S700A-4FGG484Q
XA3S700A-4FGG484Q ECAD Model
XA3S700A-4FGG484Q Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 372 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 13248 | |
| Number of Equivalent Gates | 700000 | |
| Number of CLBs | 1472 | |
| Combinatorial Delay of a CLB-Max | 4.88 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1472 CLBS, 700000 GATES | |
| Clock Frequency-Max | 667 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA484,22X22,40 | |
| Pin Count | 484 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XA3S700A-4FGG484Q Datasheet Download
XA3S700A-4FGG484Q Overview
The XA3S700A-4FGG484Q chip model is an innovative and powerful chip model that has a multitude of advantages and is expected to be in high demand in the coming years. Developed by Xilinx, the chip model is designed to be used in a variety of applications and is particularly suitable for advanced communication systems.
The XA3S700A-4FGG484Q chip model is an advanced FPGA model that is capable of supporting a wide range of communication protocols, including Ethernet, USB, and PCIe. It is designed to be highly efficient and reliable, with a low power consumption and a high level of performance. The chip model also features an integrated memory controller, allowing for faster data transfer and improved system performance.
The XA3S700A-4FGG484Q chip model is designed to be highly adaptable and upgradeable, offering users the ability to customize their system to meet their specific needs. The chip model also features an integrated security system, allowing for secure communication and data transfer. Additionally, the chip model is designed to be able to support the latest communication protocols and standards, making it ideal for use in the most advanced communication systems.
The XA3S700A-4FGG484Q chip model is expected to be in high demand in the coming years, as it is suitable for a variety of applications, including networks, intelligent systems, and fully intelligent systems. The chip model is capable of supporting a wide range of communication protocols and standards, making it suitable for use in the most advanced communication systems. Additionally, the chip model is designed to be highly adaptable and upgradeable, allowing users to customize their system to meet their specific needs.
The XA3S700A-4FGG484Q chip model is an innovative and powerful chip model that is expected to be in high demand in the coming years. It is designed to be highly efficient and reliable, with a low power consumption and a high level of performance. Additionally, the chip model is designed to be able to support the latest communication protocols and standards, making it ideal for use in the most advanced communication systems. The chip model is also highly adaptable and upgradeable, allowing users to customize their system to meet their specific needs. As such, the XA3S700A-4FGG484Q chip model is expected to be in high demand in the coming years, as it is suitable for a variety of applications, including networks, intelligent systems, and fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||