AMD Xilinx
XA3S700A-4FGG484I
XA3S700A-4FGG484I ECAD Model
XA3S700A-4FGG484I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 372 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 13248 | |
| Number of Equivalent Gates | 700000 | |
| Number of CLBs | 1472 | |
| Combinatorial Delay of a CLB-Max | 4.88 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1472 CLBS, 700000 GATES | |
| Clock Frequency-Max | 667 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA484,22X22,40 | |
| Pin Count | 484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XA3S700A-4FGG484I Datasheet Download
XA3S700A-4FGG484I Overview
The XA3S700A-4FGG484I chip model is a powerful and versatile processor that can be used for a variety of applications. It is designed to be used in high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is designed with the intention of providing users with a powerful and efficient processor that can be easily upgraded and expanded in the future.
The XA3S700A-4FGG484I chip model is also suitable for use in advanced communication systems. It provides users with the ability to develop and deploy complex communication systems with high levels of performance and reliability. The chip model also has the capability to be used in the development and popularization of future intelligent robots, providing users with the ability to create advanced robots with increased levels of autonomy and functionality.
In order to effectively use the XA3S700A-4FGG484I chip model, users must possess a strong understanding of HDL language and be familiar with the fundamentals of digital signal processing and embedded processing. Additionally, users should have a basic understanding of robotics and AI in order to be able to effectively use the chip model in the development of intelligent robots. With the right knowledge and skills, users can use the XA3S700A-4FGG484I chip model to create powerful and efficient systems that can be used in a variety of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||