
AMD Xilinx
XA3S500E-4FTG256Q
XA3S500E-4FTG256Q ECAD Model
XA3S500E-4FTG256Q Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 190 | |
Number of Outputs | 149 | |
Number of Logic Cells | 10476 | |
Number of Equivalent Gates | 500000 | |
Number of CLBs | 1164 | |
Combinatorial Delay of a CLB-Max | 4.88 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | AEC-Q100 | |
Temperature Grade | AUTOMOTIVE | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1164 CLBS, 500000 GATES | |
Clock Frequency-Max | 572 MHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 1.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FTBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XA3S500E-4FTG256Q Datasheet Download
XA3S500E-4FTG256Q Overview
The chip model XA3S500E-4FTG256Q is a powerful and versatile chip that is designed to provide a broad range of solutions for various industries. It has many advantages, such as low power consumption, high performance, low cost, and small size. These features make it an ideal choice for many applications.
The expected demand for the chip model XA3S500E-4FTG256Q is likely to increase in the future, due to its broad range of applications. It can be used in a variety of industries, such as automotive, medical, industrial, and consumer electronics. It is also expected to be used in advanced communication systems, such as 5G and beyond.
The original design intention of the chip model XA3S500E-4FTG256Q is to provide a comprehensive solution for a wide range of applications. It has a low power consumption, high performance, and low cost, making it an ideal choice for many applications. It is also possible to upgrade the chip model in the future, to provide even greater performance and features.
The chip model XA3S500E-4FTG256Q can be used in a variety of networks and intelligent scenarios. It can be used in networks such as Wi-Fi, Bluetooth, and Zigbee, as well as in intelligent scenarios such as autonomous vehicles, factory automation, and smart home systems. It is also possible to use the chip model in the era of fully intelligent systems, such as artificial intelligence and machine learning.
In conclusion, the chip model XA3S500E-4FTG256Q is a powerful and versatile chip that has many advantages, making it an ideal choice for many applications. It is expected to be in high demand in the future, due to its broad range of applications. It is also possible to upgrade the chip model in the future, to provide even greater performance and features. Finally, the chip model can be used in a variety of networks and intelligent scenarios, making it a great choice for the era of fully intelligent systems.
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1,203 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $40.1016 | $40.1016 |
10+ | $39.6704 | $396.7040 |
100+ | $37.5144 | $3,751.4400 |
1000+ | $35.3584 | $17,679.2000 |
10000+ | $32.3400 | $32,340.0000 |
The price is for reference only, please refer to the actual quotation! |