XA3S500E-4FTG256Q
XA3S500E-4FTG256Q
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rohs

AMD Xilinx

XA3S500E-4FTG256Q


XA3S500E-4FTG256Q
F20-XA3S500E-4FTG256Q
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FTBGA-256
LEAD FREE, FTBGA-256

XA3S500E-4FTG256Q ECAD Model


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XA3S500E-4FTG256Q Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 190
Number of Outputs 149
Number of Logic Cells 10476
Number of Equivalent Gates 500000
Number of CLBs 1164
Combinatorial Delay of a CLB-Max 4.88 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100
Temperature Grade AUTOMOTIVE
Package Shape SQUARE
Technology CMOS
Organization 1164 CLBS, 500000 GATES
Clock Frequency-Max 572 MHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FTBGA-256
Pin Count 256
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XA3S500E-4FTG256Q Datasheet Download


XA3S500E-4FTG256Q Overview



The chip model XA3S500E-4FTG256Q is a powerful and versatile chip that is designed to provide a broad range of solutions for various industries. It has many advantages, such as low power consumption, high performance, low cost, and small size. These features make it an ideal choice for many applications.


The expected demand for the chip model XA3S500E-4FTG256Q is likely to increase in the future, due to its broad range of applications. It can be used in a variety of industries, such as automotive, medical, industrial, and consumer electronics. It is also expected to be used in advanced communication systems, such as 5G and beyond.


The original design intention of the chip model XA3S500E-4FTG256Q is to provide a comprehensive solution for a wide range of applications. It has a low power consumption, high performance, and low cost, making it an ideal choice for many applications. It is also possible to upgrade the chip model in the future, to provide even greater performance and features.


The chip model XA3S500E-4FTG256Q can be used in a variety of networks and intelligent scenarios. It can be used in networks such as Wi-Fi, Bluetooth, and Zigbee, as well as in intelligent scenarios such as autonomous vehicles, factory automation, and smart home systems. It is also possible to use the chip model in the era of fully intelligent systems, such as artificial intelligence and machine learning.


In conclusion, the chip model XA3S500E-4FTG256Q is a powerful and versatile chip that has many advantages, making it an ideal choice for many applications. It is expected to be in high demand in the future, due to its broad range of applications. It is also possible to upgrade the chip model in the future, to provide even greater performance and features. Finally, the chip model can be used in a variety of networks and intelligent scenarios, making it a great choice for the era of fully intelligent systems.



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Unit Price: $43.12
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Pricing (USD)

QTY Unit Price Ext Price
1+ $40.1016 $40.1016
10+ $39.6704 $396.7040
100+ $37.5144 $3,751.4400
1000+ $35.3584 $17,679.2000
10000+ $32.3400 $32,340.0000
The price is for reference only, please refer to the actual quotation!

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