XA3S500E-4FT256
XA3S500E-4FT256
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AMD Xilinx

XA3S500E-4FT256


XA3S500E-4FT256
F20-XA3S500E-4FT256
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BGA

XA3S500E-4FT256 ECAD Model


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XA3S500E-4FT256 Attributes


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XA3S500E-4FT256 Overview



The Xilinx XA3S500E-4FT256 is a FPGA (Field Programmable Gate Array) chip that is used for a variety of applications. It is part of Xilinx’s Spartan-3E family of FPGA chips and is designed for high-performance, low-power applications. The XA3S500E-4FT256 offers a wide range of features, including a large number of programmable logic blocks, high-speed transceivers, and a variety of I/O options. It also has a wide range of embedded memory blocks, including Block RAM, FIFO, and ROM.


The XA3S500E-4FT256 can be used in a wide range of applications, including communications, medical imaging, industrial automation, and military systems. It is designed to be a cost-effective solution for these applications, offering high performance and low power consumption. The XA3S500E-4FT256 is also designed to be highly scalable, allowing for future upgrades and enhancements.


The XA3S500E-4FT256 is designed to be used in a variety of communication systems. It is capable of supporting high-speed serial transceivers, allowing for the transmission of data at speeds of up to 12.5 Gbps. It also supports a variety of communication protocols, including Ethernet, USB, and CAN. The chip is also designed to support advanced communication systems, such as Wi-Fi, Bluetooth, and ZigBee.


In terms of industry trends, the XA3S500E-4FT256 is expected to be in high demand in the coming years. This is due to its cost-effectiveness, scalability, and wide range of features. As new technologies emerge, the XA3S500E-4FT256 will be able to keep up with the latest trends and be able to support the latest communication systems.


The XA3S500E-4FT256 was designed with the intention of providing a high-performance, low-power, cost-effective solution for a variety of applications. It is expected to remain in high demand in the future as new technologies emerge and as the need for high-speed communication systems increases. The chip is also designed to be highly scalable, allowing for future upgrades and enhancements. This makes it an ideal solution for a variety of applications and communication systems.



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