AMD Xilinx
XA3S50-4VQG100I
XA3S50-4VQG100I ECAD Model
XA3S50-4VQG100I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 124 | |
| Number of Outputs | 124 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 50000 | |
| Number of CLBs | 192 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 192 CLBS, 50000 GATES | |
| Clock Frequency-Max | 125 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XA3S50-4VQG100I Datasheet Download
XA3S50-4VQG100I Overview
The chip model XA3S50-4VQG100I is a high-end integrated circuit (IC) developed by a leading semiconductor company. It is a powerful, low-power, and cost-effective chip that is widely used in various fields, such as communications, automotive, industrial, and consumer electronics. The model is designed to meet the demands of high-speed, low-power applications.
The original design intention of the XA3S50-4VQG100I is to provide a reliable and cost-effective solution for the development and popularization of future intelligent robots. It is designed to support advanced communication systems, such as Ethernet, Wi-Fi, and Bluetooth. The model is equipped with a wide range of features, including high-speed data transfer, low-power operation, and advanced security features.
The product description and specific design requirements of the XA3S50-4VQG100I are as follows: it supports a maximum frequency of up to 4GHz, a maximum power consumption of 0.7 W, and a low-power standby mode of 0.5 W. It also has an embedded memory controller and an integrated I/O controller. The model is designed to support a wide range of communication protocols, such as Ethernet, Wi-Fi, and Bluetooth.
In addition, the XA3S50-4VQG100I can be used in various applications, such as automotive, industrial, and consumer electronics. It is suitable for use in the development and popularization of future intelligent robots. The model is also capable of being upgraded to support more advanced communication systems.
To use the XA3S50-4VQG100I effectively, technical talents with knowledge in communication protocols, programming languages, and system design are required. In addition, there are several precautions that should be taken into consideration when using the chip model. For example, the chip should be used in an environment with proper temperature and humidity control, and it should be kept away from sources of interference.
In conclusion, the XA3S50-4VQG100I is a powerful, low-power, and cost-effective chip that is designed to meet the demands of high-speed, low-power applications. Its original design intention is to provide a reliable and cost-effective solution for the development and popularization of future intelligent robots. The chip model is capable of being upgraded to support more advanced communication systems, and it can be used in various applications, such as automotive, industrial, and consumer electronics. To use the model effectively, technical talents with knowledge in communication protocols, programming languages, and system design are required.
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4,909 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $37.2544 | $37.2544 |
| 10+ | $36.8538 | $368.5382 |
| 100+ | $34.8509 | $3,485.0895 |
| 1000+ | $32.8480 | $16,423.9850 |
| 10000+ | $30.0439 | $30,043.8750 |
| The price is for reference only, please refer to the actual quotation! | ||