AMD Xilinx
XA3S400-4FTG256I
XA3S400-4FTG256I ECAD Model
XA3S400-4FTG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 264 | |
| Number of Outputs | 264 | |
| Number of Logic Cells | 8064 | |
| Number of Equivalent Gates | 400000 | |
| Number of CLBs | 896 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100 | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 896 CLBS, 400000 GATES | |
| Clock Frequency-Max | 125 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FTBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XA3S400-4FTG256I Datasheet Download
XA3S400-4FTG256I Overview
The chip model XA3S400-4FTG256I is a product of the ever-evolving semiconductor industry, which is currently experiencing a period of rapid transformation. As the world moves towards an increasingly interconnected and intelligent future, the need for powerful and reliable semiconductor chips is becoming ever more pressing. The XA3S400-4FTG256I is one such chip, designed to meet the needs of the modern network and intelligent systems.
The XA3S400-4FTG256I is a powerful and reliable chip, capable of handling the most demanding of tasks. It is capable of supporting the latest technologies, making it ideal for use in the era of fully intelligent systems. This chip can be used to power the development and popularization of future intelligent robots, enabling them to carry out complex tasks with ease.
The XA3S400-4FTG256I is a versatile chip, capable of being used in a variety of scenarios. It can be used in networks, allowing for the transmission of large amounts of data at high speeds. It can also be used to power intelligent systems, allowing them to process large amounts of data quickly and accurately.
In order to use the XA3S400-4FTG256I effectively, certain technical talents are required. This chip requires a skilled programmer to be able to make the most of its capabilities. Furthermore, an understanding of the latest technologies is necessary in order to ensure that the chip is used in the most efficient manner possible.
In conclusion, the XA3S400-4FTG256I is a powerful and reliable chip, capable of supporting the latest technologies. It is ideal for use in networks and intelligent systems, and can be used to power the development and popularization of future intelligent robots. In order to make the most of this chip, certain technical talents are required. With the right skills and knowledge, the XA3S400-4FTG256I can be used to make the world a smarter and more connected place.
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5,798 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $22.0968 | $22.0968 |
| 10+ | $21.8592 | $218.5920 |
| 100+ | $20.6712 | $2,067.1200 |
| 1000+ | $19.4832 | $9,741.6000 |
| 10000+ | $17.8200 | $17,820.0000 |
| The price is for reference only, please refer to the actual quotation! | ||