
AMD Xilinx
XA3S400-4FGG456Q
XA3S400-4FGG456Q ECAD Model
XA3S400-4FGG456Q Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 264 | |
Number of Outputs | 264 | |
Number of Logic Cells | 8064 | |
Number of Equivalent Gates | 400000 | |
Number of CLBs | 896 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | AEC-Q100 | |
Temperature Grade | AUTOMOTIVE | |
Package Shape | SQUARE | |
Organization | 896 CLBS, 400000 GATES | |
Clock Frequency-Max | 125 MHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-456 | |
Pin Count | 456 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XA3S400-4FGG456Q Datasheet Download
XA3S400-4FGG456Q Overview
The chip model XA3S400-4FGG456Q is a powerful and versatile integrated circuit, designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is an ideal choice for advanced communication systems, as it is capable of supporting a wide range of features and functions.
The XA3S400-4FGG456Q is designed with a highly efficient and reliable architecture, allowing it to easily handle complex tasks while providing exceptional performance. The chip is equipped with a 32-bit processor and a dedicated memory controller, allowing it to quickly and accurately process data. Additionally, the chip is designed to be easily upgradable, allowing developers to add new features or functions as needed.
The XA3S400-4FGG456Q requires the use of HDL language, which is a high-level language used to program integrated circuits. This language is used to create the logic and control structures needed to control the chip’s various components. The language is also used to define the chip’s communication protocols, allowing developers to easily integrate the chip into existing systems.
When designing with the XA3S400-4FGG456Q, it is important to consider the chip’s product description and specific design requirements. This includes the chip’s power requirements, its operating temperature, and its electrical characteristics. Additionally, it is important to consider the chip’s timing requirements, as well as its memory and I/O requirements.
To help developers better understand the XA3S400-4FGG456Q and its capabilities, there are a number of case studies available. These case studies provide real-world examples of how the chip can be used in various applications. Additionally, these case studies can provide developers with an idea of the chip’s performance and limitations.
When using the XA3S400-4FGG456Q, it is important to follow the manufacturer’s instructions and guidelines. This includes ensuring that the chip is properly installed and configured, and that the power supply is adequate for the chip’s requirements. Additionally, it is important to use the appropriate HDL language when programming the chip, as incorrect programming can lead to unexpected results.
The XA3S400-4FGG456Q is a powerful and versatile integrated circuit, designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is an ideal choice for advanced communication systems, as it is capable of supporting a wide range of features and functions. With its highly efficient and reliable architecture, the chip is capable of quickly and accurately processing data. Additionally, the chip is designed to be easily upgradable, allowing developers to add new features or functions as needed. When used correctly, the XA3S400-4FGG456Q can provide exceptional performance and reliability.
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4,613 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $35.0798 | $35.0798 |
10+ | $34.7026 | $347.0258 |
100+ | $32.8166 | $3,281.6574 |
1000+ | $30.9306 | $15,465.2820 |
10000+ | $28.2902 | $28,290.1500 |
The price is for reference only, please refer to the actual quotation! |